Ultra-hard diamond grinding wheel free of binding agent and manufacturing method of ultra-hard diamond grinding wheel

A diamond grinding wheel, bond-free technology, applied in the direction of bonded grinding wheels, manufacturing tools, metal processing equipment, etc., to achieve the effect of reducing the grinding temperature, uniform distribution, and improving the overall strength

Active Publication Date: 2016-05-04
HUNAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to meet the higher requirements of new materials for the strength of their processing tools, diamond and cubic boron nitride superabrasives have been widely used. At the same time, from resin bonds, vitrified bonds, metal bonds to brazed grinding wheels, The holding strength of the bond to the abrasive grains is also continuously strengthened, but its structure still remains composed of three parts: abrasive, bond, and pores. The overall strength of the grinding wheel is still limited by the wettability between the abrasive and the bond.

Method used

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  • Ultra-hard diamond grinding wheel free of binding agent and manufacturing method of ultra-hard diamond grinding wheel
  • Ultra-hard diamond grinding wheel free of binding agent and manufacturing method of ultra-hard diamond grinding wheel
  • Ultra-hard diamond grinding wheel free of binding agent and manufacturing method of ultra-hard diamond grinding wheel

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Embodiment Construction

[0031] A bond-free superhard diamond grinding wheel, such as figure 1 As shown, the structure of the grinding wheel of the present invention is basically similar to that of the cup-type grinding wheel, and consists of two parts: a matrix and an abrasive layer. However, due to the poor wettability between diamond and the metal substrate, it is first necessary to vacuum-braze the polycrystalline CVD diamond sheet to the hard alloy, and then glue it to the aluminum substrate. figure 1 The inner and outer diameters of the abrasive layer shown in are 30mm and 38mm, respectively, and the thickness is 2mm. figure 2 It is a schematic diagram of the microstructure of the grinding wheel surface. The schematic diagram of the working surface of the abrasive layer in four structural forms is given in the figure, which are involute, square, rhombus and triangle.

[0032] The following compares the surface structure of the bond-free superhard diamond grinding wheel and the traditional grin...

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Abstract

The invention discloses an ultra-hard diamond grinding wheel free of a binding agent and manufacturing method of the ultra-hard diamond grinding wheel. The ultra-hard diamond grinding wheel free of the binding agent comprises a metal base body and a grinding material layer fixed to the metal base body. The grinding material layer is a polycrystalline chemical vapor deposited (CVD) diamond piece free of the binding agent. Grinding particles and chip grooves are machined in the working surface of the grinding material layer. In this way, the ultra-hard grinding wheel free of the binding agent is manufactured by machining the grinding particles and the chip grooves manually, and the strength of the grinding wheel is improved. The grinding particles and chip grooves of the grinding wheel are evenly distributed and are highly consistent, and thus the grinding force can be effectively reduced and the grinding temperature is decreased during grinding.

Description

technical field [0001] The invention relates to a bond-free superhard diamond grinding wheel and a manufacturing method thereof, which belongs to the design and manufacture of new processing tools in the field of mechanical manufacturing, and is mainly designed for high hardness, high strength, difficult processing and new composite materials. Background technique [0002] Grinding is one of the most widely used manufacturing process technologies, whose characteristics depend to a large extent on the tool used - the grinding wheel. Generally, the abrasive layer of a grinding wheel is composed of abrasive grains, bonding agent and pores. The hardness of the abrasive grains affects the hardness of the grinding wheel, but the holding strength of the abrasive grains by the bonding agent is the main factor affecting the hardness of the grinding wheel. [0003] In order to meet the higher requirements of new materials for the strength of their processing tools, diamond and cubic b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/00B24D5/00B24D18/00
CPCB24D3/00B24D5/00B24D18/00
Inventor 金滩曲美娜李平
Owner HUNAN UNIV
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