Novel adhesion promoters for substrate surface metallization
一种衬底表面、金属的技术，应用在金属材料涂层工艺、液态化学镀覆、叠加层的镀覆等方向，能够解决粘着性低无法等问题
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[0137] The following experiments are intended to illustrate the benefits of the invention without limiting its scope. The terms substrate and sample are used interchangeably herein.
[0138] General procedure: For adhesion testing purposes, the electroless metal layer is further electrolytically plated with 15 μm copper and thereafter heated at a temperature of 180° C. for 30 minutes. The copper plating was subjected to a 90° angle peel strength test. In the case of insufficient adhesion, the additional copper thickness strongly increases the probability of failure of the adhesive interface.
[0139] In the examples, metal oxide precursor compounds (MO) and plating catalysts (MeO) as listed and identified in Table 1 were employed.
example 1
[0140] Example 1 (comparative)
[0141] The following three commercially available samples (all: 1.5 x 4.0 cm slides) were used in this example:
[0142] ●Borosilicate glass (S a <10nm).
[0143] ●Wafer substrate, Si / SiO 2 (S a 2 layer,
[0144] ●Ceramic substrate, Al2 o 3 (S a = 450nm).
[0145] Samples were cleaned and processed as described below.
[0146] Make the substrate with 50ppm Pd ion and 2.5g / L SnCl 2 The commercially available Pd / Sn catalyst ( Activator (Activator), Atotech (Atotech Deutschland GmbH)) was contacted at a temperature of 25° C. for 5 minutes, followed by a deionized water rinse and an acceleration step ( Accelerator (Accelerator, Atotech) was used to increase the catalytic activity of the Pd catalyst.
[0147] Thereafter, the samples were completely submerged in an electroless Cu bath containing copper sulfate as a source of copper ions and formaldehyde as a reducing agent at 37°C for 4 minutes, resulting in a plating thickness of about ...
example 2
[0153] The following three commercially available samples (total: 1.5 x 4.0 cm slides) were used:
[0154] ●Glass (S a <10nm).
[0155] ●Wafer substrate, Si / SiO 2 (S a 2 layer,
[0156] ●Ceramic substrate, Al 2 o 3 (S a = 450nm).
[0157] After cleaning, the samples were sequentially coated with ZnO and CuO layers by spray pyrolysis. First, spray the substrate containing 0.05mol / l Zn(OAc) on the substrate heated at 400°C by a hand-held air brush device 2 ×2H 2 EtOH solutions of metal oxide precursor compounds of O (spray pyrolysis). Subsequently, at a temperature of 400 ° C, a process containing 0.05 mol / l Cu(OAc) 2 ×H 2 Another spray pyrolysis of transition metal plating catalyst precursor compounds of O in EtOH.
[0158] The substrate was then heated in air at a temperature of 500°C for 60 minutes. The formed ZnO metal oxide layer had a thickness of about 150 nm, and the formed CuO layer had a thickness of about 30 nm.
[0159] After sintering, the samples wer...
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