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Epoxy resin adhesive used for bonding polypropylene

A technology of epoxy resin and adhesive, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of explosion, easy to burn, difficult to prepare and mass production, etc., achieve excellent adhesion, simplify The effect of using technology and raw materials is cheap and easy to obtain

Active Publication Date: 2016-06-01
HANGZHOU BAOMING NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, organoborane is highly flammable and needs to be stabilized with amine complexes. In the process of preparing organoborane amine complexes, it needs to be diluted with a large amount of solvent, and it is very easy to burn or even explode; it is difficult to prepare and mass production

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The following raw materials are mixed uniformly: 46.5g of bisphenol A type epoxy resin (EPON-828, Shell Company), 52.0g of polyether polythiol cross-linking agent (Capcure3800; Corning Company) containing thiol group end group, pass Benzoyl Oxide (CAS94-36-0, Bailingwei Company) 0.5g; Then, add benzyldimethylamine (CAS103-83-3, Bailingwei Company) 1.0g to the above-mentioned mixed solution and mix quickly, and then Adhesion tests were performed on standard polypropylene strips (without surface treatment). After curing at room temperature for 24 hours, see Table 1 for the tensile test data.

Embodiment 2

[0024] Mix the following raw materials evenly: rubber toughened epoxy resin (MX-257, Zhongyuan Company) 73.3g, alkyl polythiol compound (Lecad803; Sakai Chemical Company) 25.2g, cumene hydroperoxide (CAS80- 15-9, Bailingwei Company) 0.3g; then, add triethylenediamine (CAS280-57-9, Bailingwei Company) 1.2g to the above-mentioned mixed solution, after mixing quickly and uniformly, on a standard polypropylene sample strip ( No surface treatment) for adhesion test. After curing at room temperature for 24 hours, see Table 1 for the tensile test data. Example 3

Embodiment 3

[0025] Mix the following raw materials evenly: 64.0g of bisphenol F epoxy resin (EPIKOTE862, Shell Company), 34.2g of 1,6-hexanedithiol (CAS1191-43-1; Shanghai Zhuorui Chemical Co., Ltd.), hydrogen peroxide Dicumylbenzene (CAS26762-93-6, Bailingwei Company) 0.8g; Then, add 1,8-diazobicyclo[5.4.0]undec-7-ene (CAS6674- 22-2, Bailingwei Co.) 1.0g was quickly mixed evenly, and the adhesion test was carried out on a standard polypropylene sample (without surface treatment). After curing at room temperature for 24 hours, see Table 1 for the tensile test data.

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PUM

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Abstract

The invention discloses an epoxy resin adhesive used for bonding polypropylene. The epoxy resin adhesive is prepared from, by mass, 40.0-85.0 parts of epoxy resin, 25.0-65.0 parts of polythiol crosslinking agent, 0.1-1.0 part of tertiary amine catalyst and 0.1-1.5 parts of organic peroxide cocatalyst. According to the epoxy resin adhesive, a base material does not need to be preprocessed, an organic borane catalyst difficult to prepare is not used, rapid solidification can be conducted at room temperature, and the epoxy resin adhesive has excellent cohesive force for the polypropylene base material; in addition, the raw materials selected in the epoxy adhesive preparation process are low in price and easy to obtain.

Description

technical field [0001] The invention relates to the technical field of epoxy resin adhesives, in particular to an epoxy resin adhesive used for bonding polypropylene. Background technique [0002] Low surface energy polypropylene has a wide range of applications in many fields such as electronics, automotive parts and furniture; however, due to the low surface energy of polypropylene, it is difficult to find adhesives that can bond to it. The reasons are as follows: (1) its surface energy is very low, so that the wettability of the adhesive to low surface energy materials is very poor; (2) the surface of low surface energy materials is highly inert, and its surface has no polar functional groups, making the adhesive and low surface energy materials The van der Waals force between surface energy materials is very small; (3) Most low surface energy materials are highly crystalline materials, which makes the diffusion of adhesives to low surface energy materials very poor. [...

Claims

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Application Information

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IPC IPC(8): C09J163/00C08G59/68
CPCC08G59/686C09J163/00
Inventor 李志明林江滨
Owner HANGZHOU BAOMING NEW MATERIAL TECH CO LTD
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