A modified polyphenylene oxide material with low dielectric loss and a preparing method thereof

A modified polyphenylene oxide material is provided. The modified polyphenylene oxide material is prepared from 30-85 parts by weight of polyphenylene oxide material, 10-42 parts by weight of polystyrene, 3-15 parts by weight of a flexibilizer, 5-25 parts by weight of a filler, 0.2-0.7 part of a lubricant and 0.2-0.5 part by weight of an antioxidant. A preparing method of the modified polyphenylene oxide material is also disclosed. The method includes weighing the 30-85 parts by weight of the polyphenylene oxide material, the 10-42 parts by weight of the polystyrene, the 3-15 parts by weight of the flexibilizer, the 5-25 parts by weight of the filler, the 0.2-0.7 part of the lubricant and the 0.2-0.5 part by weight of the antioxidant, fully mixing through a high-speed mixer, adding the mixture into a screw extruder, drawing into bars through the screw extruder, and granulating to obtain the modified polyphenylene oxide material. The polyphenylene oxide is adopted as a base material. The polyphenylene oxide has good electric properties, has the minimum dielectric loss factor in engineering plastics, and is low in influences by frequency and temperature. Addition of the polystyrene increases fluidity of the material so that the material is convenient to process and can be directly subjected to injection molding.