Photocuring solder-resist ink
A solder mask ink, light curing technology, applied in the direction of ink, optics, organic chemistry, etc., can solve the problems of the accuracy of pattern size and the lack of uniformity of pattern edges.
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Embodiment 1
[0047] 1) Preparation of solder mask ink:
[0048] The components shown in Table 1 were blended in the amounts (parts by mass) shown in Table 1, and stirred, mixed and dispersed to obtain light-curable solder resist ink formulations A-E.
[0049] Table 1
[0050]
[0051] 2) Film forming process of solder mask:
[0052] Screen print each light-curing solder mask ink formulation on the deoxidized copper clad board, use a hot air circulation drying oven, dry at 75 ℃ for 40 minutes, after drying, slowly cool to room temperature, and fix the line width on it. 20μm and 150μm line width pattern photomask, with mercury lamp at 150mJ / cm 2 Exposure amount for front exposure, using 1wt% Na 2 CO 3 The aqueous solution was developed with a spray pressure of 0.25MPa and a temperature of 30°C for 90 seconds, and then washed and dried.
[0053] 3) Performance evaluation of solder mask:
[0054] Edge neatness evaluation:
[0055] Use a 100-fold stereo microscope to observe the edge regularity of the pat...
Embodiment 2
[0075] Replace the exposure light source with a 365nm LED lamp. The other process is the same as in Example 1. The results are listed in Table 3.
[0076] table 3
[0077]
[0078] Conclusion: 5-(4-isopropylphenylthio)indan-1,2-dione-2-oxime-O-acetate formulation A and 5-(n-butoxy)indan- The formula B of 1,2-diketone-2-oxime-O-acetate has better comprehensive effects than formulas C, D, and E in the test.
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