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Flexible conductive silver paste and manufacturing method

A flexible conductive and silver paste technology, applied in the field of fine chemicals, can solve the problems of reducing the conductive stability of flexible circuits, increasing short circuits, reducing the service life of flexible circuits, etc., achieving excellent adhesion and bending resistance, and improving stability The effect of excellent performance, adhesion and bending resistance

Active Publication Date: 2016-06-22
广州市昌鹏实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the existing flexible circuit boards, the adhesion of the conductive silver paste is not strong enough, and the bending resistance is not good, which reduces the conductive stability of the flexible circuit, increases the probability of short circuit, and reduces the service life of the flexible circuit.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A flexible conductive silver paste, based on the total mass of the flexible conductive silver paste as 100%, the components and mass percentages are as follows: 40% silver nanowires, 5% hydroxyethyl methacrylate phosphate, acetic acid 18% butyl ester, 30% polyurethane resin, 5% polyvinyl butyral, 1% defoamer, 1% curing agent.

[0026] The preparation method of above-mentioned flexible conductive silver paste, concrete steps are as follows:

[0027] (1) Mix 40% silver nanowires (Nanjing Xianfeng Nano Material Technology Co., Ltd.), 5% hydroxyethyl methacrylate phosphate and 18% butyl acetate to obtain mixture a;

[0028] (2) 30% polyurethane resin (Bayer, thermoplastic polyurethane resin, Desmolac? 2100), 5% polyvinyl butyral, 1% defoamer (Bick, BYK-066N) and 1% curing agent ( Moca, 4,4'-diamino-3,3'-dichlorodiphenylmethane) were mixed uniformly to obtain mixture b;

[0029] (3) Mix mixture a and mixture b evenly, and grind the slurry with a three-roll mill until the p...

Embodiment 2

[0032] A flexible conductive silver paste, based on the total mass of the flexible conductive silver paste as 100%, the components and mass percentages are as follows: 60% silver nanowires, 1% hydroxyethyl methacrylate phosphate, acetic acid Butyl ester 18%, polyurethane resin 15%, polyvinyl butyral 5%, defoamer 0.5%, curing agent 0.5%.

[0033] The preparation method of above-mentioned flexible conductive silver paste, concrete steps are as follows:

[0034] (1) Mix 60% silver nanowires (Nanjing Xianfeng Nano Material Technology Co., Ltd.), 1% hydroxyethyl methacrylate phosphate and 18% butyl acetate to obtain mixture a;

[0035] (2) 15% polyurethane resin (Bayer, thermoplastic polyurethane resin, Desmolac? 2100), 5% polyvinyl butyral, 0.5% defoamer (Bick, BYK-066N) and 0.5% curing agent ( Moca, 4,4'-diamino-3,3'-dichlorodiphenylmethane) were mixed uniformly to obtain mixture b;

[0036] (3) Mix mixture a and mixture b evenly, and grind the slurry with a three-roll mill unt...

Embodiment 3

[0039] A flexible conductive silver paste, based on the total mass of the flexible conductive silver paste as 100%, the components and mass percentages are as follows: 30% silver nanowires, 3% hydroxyethyl methacrylate phosphate, butyl Ketone 30%, polyurethane resin 20%, polyvinyl butyral 10%, defoamer 2%, curing agent 5%.

[0040] The preparation method of above-mentioned flexible conductive silver paste, concrete steps are as follows:

[0041] (1) Mix 30% silver nanowires (Nanjing Xianfeng Nano Material Technology Co., Ltd.), 3% hydroxyethyl methacrylate phosphate and 30% butanone to obtain mixture a;

[0042] (2) 20% polyurethane resin (Bayer, thermoplastic polyurethane resin, Desmolac? 2100), 10% polyvinyl butyral, 2% defoamer (Bick, BYK-066N) and 5% curing agent ( Moca, 4,4'-diamino-3,3'-dichlorodiphenylmethane) were mixed uniformly to obtain mixture b;

[0043] (3) Mix mixture a and mixture b evenly, and grind the slurry with a three-roll mill until the particle size i...

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Abstract

The invention belongs to the field of fine chemicals, and particularly discloses a flexible conductive silver paste and a manufacturing method. The mass percentage of each component of the flexible conductive silver paste is as follows: 30 to 60% of silver nanowires, 1 to 5% of 2-hydroxyethyl methacrylate phosphate, 18 to 30% of a solvent, 15 to 30% of polyurethane resin, 5 to 10% of polyvinyl butyral, 0.5 to 2% of a defoamer and 0.5 to 5% of a curing agent. According to the flexible conductive silver paste, through adding of the 2-hydroxyethyl methacrylate phosphate, due to hydrogen bonding effects generated between hydroxyl groups on 2-hydroxyethyl methacrylate phosphate molecules and the silver nanowires and the polyurethane resin, the stability of the silver nanowires in organic resin is improved, and the flexible conductive silver paste with excellent adhesion and bending resistance performance is obtained. Through adjusting the using amounts of the 2-hydroxyethyl methacrylate phosphate, the silver nanowires and the polyurethane resin, the obtained flexible conductive silver paste has excellent adhesion and bending resistance performance.

Description

technical field [0001] The invention belongs to the field of fine chemicals and relates to a conductive silver paste, in particular to a flexible conductive silver paste and a preparation method. Background technique [0002] Flexible conductive silver paste is an internationally recognized high-end manufacturing of high-tech, high-difficulty and high-value-added products, and is an indispensable core key material for the development of flexible transparent circuits. The flexible transparent circuit can be bent, wound and folded freely, can be arranged arbitrarily according to the requirements of the space layout, and can be moved and stretched arbitrarily in the three-dimensional space, so as to achieve the integration of component assembly and wire connection, provide excellent electrical performance, and meet the requirements of smaller It is the only solution to meet the miniaturization and mobile requirements of electronic products, and has broad application prospects i...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B3/30B82Y30/00
CPCB82Y30/00H01B1/22H01B3/30
Inventor 胡云睿陈嘉胡云庆
Owner 广州市昌鹏实业有限公司
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