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A method for manufacturing a chip oxygen sensor chip

An oxygen sensor and manufacturing method technology, applied in instruments, scientific instruments, measuring devices, etc., can solve the problems of easy introduction of impurities, high cost, poor performance, etc., and achieve enhanced heat transfer effect, reduced production cost, and simple process flow. Effect

Active Publication Date: 2018-01-16
徐州芯源诚达传感科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The disadvantages of this method are: the blank is too brittle, the yield is low, the sintering is easy to deform, the sealing is difficult, and its shock resistance and thermal shock resistance are very poor, so it is a kind of manufacturing with high cost and poor performance. method
[0008] The disadvantages of this method are: rolling film forming is easy to introduce impurities, and at the same time, the stress of the formed substrate is relatively large, the thickness uniformity is poor, there are more bubbles, and the compactness is poor
[0010] This method is currently the mainstream production method, and its disadvantages are: the upper and lower insulation of the heating plate increases the difficulty of the production process and the yield is low

Method used

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  • A method for manufacturing a chip oxygen sensor chip
  • A method for manufacturing a chip oxygen sensor chip
  • A method for manufacturing a chip oxygen sensor chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Such as figure 1 , figure 2 As shown, the structure of the oxygen sensor chip is an upper functional sheet (abbreviated as the upper sheet 3), a middle channel forming sheet (abbreviated as the middle sheet 2) and a lower layer sheet (abbreviated as the lower sheet 1), which are sequentially stacked and hot-pressed to form a whole. Its manufacturing process steps include: A. Preparation of casting slurry: adding 1.5% dispersant triethanolamine, 10% Adhesive polyvinyl butyral, 5% plasticizer butyl benzyl phthalate and 5% lubricant polyethylene glycol are made into cast slurry in an organic solvent by ball milling; B , Casting: Scrape the casting slurry on the casting machine with a scraper on the backing belt to form a film of uniform thickness, and remove the film after drying; C. Lamination punching: Laminate the upper, middle and lower blanks of the designed thickness, Make positioning holes and process holes with a punching machine respectively; D, printing: print...

Embodiment 2

[0030] The structure of the oxygen sensor chip is simplified as an upper layer functional sheet and a lower layer sheet, which are sequentially stacked and hot-pressed to form a whole. The process steps are the same as in Example 1. The design of the upper layer functional sheet is as follows: image 3 As shown, the printing steps are: printing and coating the internal electrode 5 and the external electrode 11 on the upper sheet 3, printing the protective layer 13 on the working area of ​​the external electrode 11, printing and coating the insulating layer 9, The heating resistor 10 and the cover layer 12, the inner electrode 5 is connected to the pin 6 of the outer layer through a small hole, the outer electrode is connected to the outer electrode pin 7 through a lead wire, and the heating resistor is connected to the heating resistor pin 8 through a lead wire; The air channel 4 is formed by upper printing.

[0031] All the other are identical with embodiment 1.

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Abstract

The invention relates to a method for manufacturing a sheet type oxygen sensor chip. The chip structurally comprises an upper-layer functional piece, a middle channel forming piece and a lower-layer piece which are sequentially stacked and hot-pressed to be manufactured into a whole. The upper-layer piece is integrated with a sensing unit and a heating resistor, the heating resistor and an external electrode are printed on the head area of the chip on the plane of the upper-layer piece in a staggered mode, and the heating resistor and the external electrode are connected with pins through leads respectively. The method eliminates influences, caused when an upper insulating layer and a lower insulating layer are printed between the middle piece and the lower piece, on the overall strength of the chip, and accordingly the final strength of the chip is improved. Layer-penetrating conductive holes of the heating resistor do not exist, the technology is simple, the insulating effect is better, and overall manufacturing cost is further reduced.

Description

technical field [0001] The invention relates to a manufacturing method of an oxygen sensor, in particular to a manufacturing method of a heating chip oxygen sensor chip. The chip oxygen sensor is applied to an electric fuel injection system of an automobile engine, and the air-fuel ratio is controlled by feedback of detecting the oxygen content of the exhaust gas. Thereby reducing exhaust emissions. Background technique [0002] The environmental pollution caused by automobile exhaust emissions is the main source of air pollution. The main technical route adopted now is to use the oxygen sensor to detect the oxygen content of the exhaust gas as the core EFI system, and control the air-fuel ratio of the engine near the theoretical air-fuel ratio (14.7±0.2) , Exhaust gas can be efficiently converted into harmless gas through the three-way catalytic converter, minimizing pollution. At present, the oxygen sensors used in automobiles are mainly zirconia oxygen sensors. Zirconia...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N27/409
CPCG01N27/4071G01N27/409
Inventor 赵芃谢光远甘章华罗志安
Owner 徐州芯源诚达传感科技有限公司
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