Vacuum packaging assembly for non-refrigeration infrared detector
An uncooled infrared and vacuum packaging technology, applied in measurement devices, electrical radiation detectors, instruments, etc., can solve problems such as thermal radiation damage of thermoelectric coolers and detector chips, and achieve low leakage rate, stable structure, high sealing effect
Inactive Publication Date: 2016-07-13
SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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Problems solved by technology
[0004] In addition, in order to improve the vacuum holding capacity of the inner cavity of the sealed detector, an electrically heated getter is installed inside. When the getter is working, its surface temperature should be above 300°C, which is easy to damage the nearby thermoelectric cooler and Detector Chip Causes Thermal Radiation Damage
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[0024] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0025] 1. Production and preparation of parts
[0026] a) Shell 1 is processed by alloy metal such as Kovar. Four symmetrically distributed mounting holes 111 are processed on the shell 110 of the shell 1 for installation and alignment of components; at the same time, the ceramic transition seat 120 is welded on the shell 110 of the shell 1; the exhaust pipe 130 is brazed on the housing 110 of the housing 1 . The surface of the shell 1 is gold-plated for the sealing welding of the shell 1 and the cap 2 . Exhaust pipe 130 is processed by oxygen-free copper pipe, and the surface is plated with gold to prevent oxidation.
[0027] b) The thermoelectric cooler 5 is a double-sided metallized cooler, and the pins are tinned copper leads. The type selection depends on the scale, power consumption, working temperature and ambient temperature of the ...
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The invention discloses a vacuum packaging assembly for a non-refrigeration infrared detector. The vacuum packaging assembly for a non-refrigeration infrared detector is characterized in that a thermoelectric cooler is welded on a housing through metal welding flux; a lead of the thermoelectric cooler is welded on a thermoelectric cooler electrical connection pin on the housing; a getter with a gas absorption function is connected with a getter pin of the housing through an electric resistance welding technology; a stainless steel metal sheet with a special shape is welded between the getter and the thermoelectric cooler; a non-refrigeration infrared detector chip is pasted on a cold end surface of the non-refrigeration thermoelectric cooler, and is connected with a chip electrical connection pin on the housing through a bonding technology; a window is welded with a pipe cap through metal welding flux, and is sealed with the housing through parallel seam welding; after accomplishment of parallel seam welding, a combination piece is connected with the cavity of a vacuum device through an exhaust pipe, and is maintained under certain temperature and then is exhausted for a period of time; and after end of exhausting, the exhaust pipe is cold-clamp-sealed, and is sealed and coated with protective glue.
Description
technical field [0001] The invention discloses a vacuum packaging method of an uncooled infrared detector. The method can realize the vacuum sealing of the uncooled infrared detector. The method is also applicable to micro-electromechanical system (MEMS) detection by partially adjusting the structure and assembly position of the parts. Vacuum packaging of the device. Background technique [0002] The uncooled infrared detector is a special thermal detection device, usually composed of a million or more detection elements, the main part of each detection element is a bridge-type suspension structure, and the two ends are connected to the circuit below through bridge piers. The pier has the functions of heat insulation, support and electrical connection. This structure is very sensitive to thermal signals, and the heat conduction of the gas will significantly reduce the detection performance, and even cause the detector to fail to work normally. Therefore, the uncooled red ti...
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IPC IPC(8): G01J5/20
CPCG01J5/20G01J2005/204
Inventor 徐勤飞刘大福莫德锋杨力怡蒋梦蝶张磊李雪
Owner SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI