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Flowing type chip-grade bottom filling adhesive and preparation method thereof

An underfill, chip-level technology, applied in the direction of adhesive, epoxy resin, adhesive type, etc., can solve the problems of poor moisture resistance, poor heat resistance, low reliability, etc., and achieve low moisture absorption and bending mold. High volume and high reliability

Active Publication Date: 2016-07-27
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the underfills currently have shortcomings such as high brittleness, low reliability, large internal stress, poor heat resistance, and poor moisture resistance, which can only meet the requirements of secondary packaging.

Method used

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  • Flowing type chip-grade bottom filling adhesive and preparation method thereof
  • Flowing type chip-grade bottom filling adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] A method for preparing a fluid chip-level underfill, the steps are as follows:

[0040] (1) Weigh 180g of bisphenol A epoxy resin E5180g, 100g of novolac epoxy resin DEN431 and 5g of carbon black, put them into the reaction kettle and stir at a speed of 1000rpm for 0.5~1h, after mixing evenly, put them into the reaction kettle after grinding;

[0041] (2) Weigh 20g of liquid carboxyl-terminated nitrile rubber, 10g of fatty alcohol polyoxyethylene ether and 5g of γ-mercaptopropyltrimethoxysilane, put them into the reaction kettle and stir at a speed of 1000rpm for 1-2h, and mix well;

[0042] (3) Weigh 700g of silicon micropowder with an average particle size of 7.5μm, put it into the reaction kettle and stir it at a speed of 1000rpm for 2-4 hours, mix well, put it into the reaction kettle after grinding, and control the temperature at 40-80℃ , let stand for 3~8h;

[0043] (4) Control the temperature at 20-25°C, weigh 80g of methyltetracyanophthalic anhydride, put it in...

Embodiment 2

[0045] A method for preparing a fluid chip-level underfill, the steps are as follows:

[0046] (1) Weigh 120g of bisphenol F-type epoxy resin EPIKOTE983U, 100g of polycyclic aromatic epoxy resin EPICLONHP4700 and 5g of carbon black, put them into the reaction kettle and stir at a speed of 1000rpm for 0.5-1h. After mixing evenly, put them into the reaction kettle after grinding ;

[0047] (2) Weigh 30g of methylphenylethylene silicone rubber, 10g of aliphatic amine polyoxyethylene ether and 5g of β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, put them into the reaction kettle and stir for 1 ~2h, mix well;

[0048] (3) Weigh 630g of silica powder with an average particle size of 1.5μm, put it into the reactor and stir it at a speed of 1000rpm for 2-4 hours, mix well, put it into the reactor after grinding, and control the temperature at 40-80°C , let stand for 3~8h;

[0049] (4) Control the temperature at 20-25°C, weigh 100g of the modified aromatic amine, put it into the reac...

Embodiment 3

[0051] A method for preparing a fluid chip-level underfill, the steps are as follows:

[0052](1) Weigh bisphenol A type epoxy resin E44160g, polycyclic aromatic epoxy resin EPICLONHP4500100g and carbon black 5g, put them into the reaction kettle and stir at a speed of 1000rpm for 0.5~1h, after mixing evenly, put them into the reaction kettle after grinding ;

[0053] (2) Weigh 20g of dimethylphenylethylene silicone rubber, 5g of aliphatic amine polyoxyethylene ether and 10g of β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and put them into the reaction kettle to Stir at a speed of 1000rpm for 1~2h, mix well;

[0054] (3) Weigh 560g of silicon micropowder with an average particle size of 5 μm, put it into the reaction kettle and stir it at a speed of 1000rpm for 2 to 4 hours, mix evenly, put it into the reaction kettle after grinding, and control the temperature at 40 to 80°C. Stand still for 3-8 hours;

[0055] (4) Control the temperature at 20-25°C, weigh 140g of modified...

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Abstract

The invention belongs to the technical field of filling adhesive preparation and particularly relates to flowing type chip-grade bottom filling adhesive and a preparation method thereof. No diluents is adopted in the chip-grade bottom filling adhesive prepared through the method, the adhesive has the advantages of being high in flowing speed, high in reliability, low in thermal expansion coefficient, high in bending modulus, low in moisture absorbility and the like, through adding of wetting dispersant, the effects of effectively lowering viscosity and increasing flowing speed are remarkable, it is more effective to disperse the filling material uniformly, and reliability of a packaged component is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of filling glue preparation, in particular to a flow type chip-level bottom filling glue and a preparation method thereof. Background technique [0002] With the rapid development of the electronic packaging industry, more stringent requirements are put forward for electronic packaging materials. Since the coefficient of thermal expansion of the chip made of silicon material is much lower than that of the substrate, in order to protect the chip, solder balls and solder joints and enhance the reliability of the chip, underfill is widely used in electronic packaging materials. The underfill is usually made of epoxy resin system, which has excellent properties such as high toughness, corrosion resistance, high viscosity and good insulation. However, most of the underfills currently have shortcomings such as high brittleness, low reliability, high internal stress, poor heat resistance, and poor moisture resista...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/02C09J11/04C09J11/06C09J11/08
CPCC09J163/00C08L2203/20C08L2205/025C08L2205/035C09J11/04C09J11/06C09J11/08C08L63/00C08L13/00C08L71/02C08L83/04C08K13/02C08K3/04C08K5/548C08K3/36C08K5/315C08K5/5435C08K5/18
Inventor 闫善涛王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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