Preparation method of heat conducting glue film with high heat radiation performance

Abstract

The invention relates to a preparation method of a heat conducing glue film with a high heat radiation performance, and belongs to the technical field of heat conducing glue film preparation. The preparation method comprises the following steps: at first, mixing ethylene-vinyl acetate copolymer and an antioxidant, heating the mixture, carrying out film casting, allowing the film to stand still for a while to cool the film; stretching the film, then allowing the film to stand still for a while to cool the film to obtain an ethylene-vinyl acetate microporous film, saving the ethylene-vinyl acetate microporous film for later use; then mixing acrylamide and 2-mercapto benzoic acid, heating, filtering, washing and drying the filter residues to obtain composite microgel, then mixing microgel with anhydrous ethanol, carrying out ultrasonic vibration and separation, mixing with deionized water, dropwise adding a silver nitrate solution, carrying out water bath heating, dropwise adding an ammonia liquor solution, allowing the mixed solution to stand still to carry out aging to obtain silver ion composite gel; finally soaking the ethylene-vinyl acetate microporous film in the silver ion composite gel, carrying out ultrasonic vibration, allowing the system to stand still, drying, performing hot pressing, finally allowing the system to stand still, and cooling. The prepared heat conducing glue film has a good heat radiation performance, the heat radiation performance is improved by 15 to 17%, and the heat conductivity can reach 2.55 to 2.65 W / M.K.

Description

technical field [0001] The invention relates to a method for preparing a high heat dissipation thermally conductive adhesive film, and belongs to the technical field of thermally conductive adhesive film preparation. Background technique [0002] With the rapid development of electronics and electrical technology, people's demand for electronic products is increasing, and the requirements for electronic products are also getting higher and higher, especially as LEDs enter people's lives as lighting devices. The heat dissipation performance requirements of circuit boards are also getting higher and higher. Therefore, some aluminum-based circuit boards with high heat dissipation performance are welcomed by the market. The structure of the aluminum base plate currently on the market is basically formed by laying a layer of heat-conducting insulating sheet on the aluminum plate, which can play the role of heat conduction on the one hand, and also has the effect of insulation on...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention: Aiming at the poor heat dissipation performance of the thermally conductive adhesive film prepared by impregnating the resin system with glass fiber cloth through high-temperature semi-curing molding, it is difficult to meet the development requirements of high-power and high-heat dissipation electronic products. -Vinyl acetate copolymer is cast into a film, then stretched transversely and longitudinally, and hot-pressed to prepare a microporous film, and then prepare a silver-loaded gel, which is immersed in the silver-loaded gel through the microporous film to make the net A method of preparing a high-heat dissipation thermally conductive adhesive film by loading silver-loaded gel on micropores, followed by heating and curing. The thermally conductive adhesive film prepared by the present invention has good heat dissipation performance, and at a relatively high temperature, the aluminum-based circuit board can effectively dissipate heat.