Unlock instant, AI-driven research and patent intelligence for your innovation.

Processing method for ethyl cellulose microcapsules of copper powder in electronic slurry

A technology of ethyl cellulose and electronic paste, applied in metal processing equipment, transportation and packaging, etc., can solve the problems of easy oxidation, etc., achieve the effect of improving electrical conductivity, simple process route, and overcoming complex process

Active Publication Date: 2016-08-10
TONGXIANG BEITE TECH CO LTD
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The object of the present invention is to provide a kind of ethyl cellulose microcapsule treatment method of copper powder in electronic slurry, use ethyl cellulose microcapsules to coat copper powder, solve the problem of copper powder in copper electronic slurry in air and high temperature environment easily oxidized

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] Take copper powder with an average particle size of 1 μm and grind it in a mortar to obtain a uniform particle size and relatively clean copper powder A; take out copper powder A and pour it into dilute hydrochloric acid with a mass percentage concentration of 7%. Powder A needs to be added with 2ml of dilute hydrochloric acid, and pickled by ultrasonic oscillation, so that copper powder A is evenly dispersed in dilute hydrochloric acid, and the ultrasonic oscillation time is 1min to form a mixed dispersion of copper powder A-acid pickling solution; first stand Copper powder A-pickling liquid mixed dispersion for 2min, then filter out the liquid in the copper powder A-pickling liquid mixed dispersion to obtain copper powder B; clean copper powder B with deionized water until the surface of copper powder B is Up to brownish red, wherein the number of times of washing with deionized water is 3 times to obtain pure copper powder with a clean surface;

[0064] Measure xylen...

Embodiment 2

[0067] Take copper powder with an average particle size of 5 μm and put it into a mortar for grinding to obtain copper powder A with a uniform particle size and relatively clean; take out copper powder A and pour it into dilute hydrochloric acid with a mass percentage concentration of 8%. Powder A needs to be added with 3ml of dilute hydrochloric acid, pickled by ultrasonic oscillation, so that copper powder A is evenly dispersed in dilute hydrochloric acid, and the ultrasonic oscillation time is 2min, forming a mixed dispersion of copper powder A-pickling liquid; Copper powder A-pickling liquid mixed dispersion for 3min, then filter out the liquid in the copper powder A-pickling liquid mixed dispersion to obtain copper powder B; clean copper powder B with deionized water until the surface of copper powder B is Up to brownish red, wherein the number of times of washing with deionized water is 4 times to obtain pure copper powder with a clean surface;

[0068] Measure xylene an...

Embodiment 3

[0071] Take copper powder with an average particle size of 10 μm and put it into a mortar for grinding to obtain copper powder A with uniform particle size and relatively clean; take out copper powder A and pour it into dilute hydrochloric acid with a concentration of 7.5% by mass percentage, and each gram of copper Powder A needs to be added with 4ml of dilute hydrochloric acid, pickled by ultrasonic oscillation, so that copper powder A is evenly dispersed in dilute hydrochloric acid, and the ultrasonic oscillation time is 3min, forming a mixed dispersion of copper powder A-acid wash liquid; Copper powder A-pickling solution mixed dispersion for 4min, then filter out the liquid in the copper powder A-pickling solution mixed dispersion to obtain copper powder B; clean copper powder B with deionized water until the surface of copper powder B is Up to brownish red, wherein the number of times of washing with deionized water is 5 times to obtain pure copper powder with a clean sur...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a processing method for ethyl cellulose microcapsules of copper powder in electronic slurry. The processing method specifically comprises the steps that (1) the obtained copper powder is sequentially subjected to grinding, acid pickling and washing, and pure copper powder with the clean surface is obtained; (2) dimethylbenzene and polyethylene glycol are mixed evenly into a mixed solution, then ethyl cellulose is weighed and added into the mixed solution, the ethyl cellulose and the mixed solution are mixed evenly through water bath heating and stirring, and a microcapsule wall material solution is formed after cooling; and (3) the pure copper powder is added into the microcapsule wall material solution, the pure copper powder and the microcapsule wall material solution are mixed through stirring and ultrasonic vibration and dispersion, static deposition, cleaning and drying are conducted in sequence, and wrapping treatment for the ethyl cellulose microcapsules of the copper powder is finished. By the adoption of the processing method for the ethyl cellulose microcapsules of the copper powder in the electronic slurry, the oxidation resistance of the copper powder is improved, and the method has extremely important significance to improving the conductivity of the conductive slurry and developing the electronic slurry industry in China.

Description

technical field [0001] The invention belongs to the technical field of material modification methods, and in particular relates to a method for treating copper powder in electronic slurry with ethyl cellulose microcapsules. Background technique [0002] Electronic paste integrates metallurgy, chemical industry and electronic technology. It is a high-tech electronic functional material and has an irreplaceable position in the electronic industry. With the rapid development of electronics, information, and communication industries, the demand for electronic paste (conductive coating, conductive adhesive) as the core material is also increasing, and the requirements for performance are also getting higher and higher. [0003] my country's electronic paste industry lags far behind the world's advanced countries in terms of production technology, product variety, product quality and market share, especially in terms of medium and high-end products, which have been obtained by rel...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B22F1/02
CPCB22F1/102
Inventor 屈银虎尚润琪王翔祁志旭时晶晶
Owner TONGXIANG BEITE TECH CO LTD