Online frequency measurement system for quartz wafer grinding

Abstract

The invention discloses an online frequency measurement system for quartz wafer grinding. The system comprises a power module, an MCU control system module, a DDS module, a radio-frequency power amplifying module, a pi network interface circuit module, a signal amplifying and filtering module, a radio-frequency amplitude detection module and a touch screen module. According to the system, the anti-interference performance of the system is enhanced through the pi network maximum transmission method detection principle based on a DDS technology, and the problem that in an existing ALC system, frequency measurement value jumping change is generated at some frequency bands is solved; all the frequency bands adopt a unified pi network interface circuit, therefore, the defect that a detection head needs to be replaced at the different frequency bands of the existing ALC system is overcome, the electrical failure risk caused by frequent plugging of a radio-frequency connector is reduced, the working stability of the system is enhanced, and the wafer grinding quality and the product quality stability can be significantly improved; through a hardware system scheme, not only can all the frequency bands related to existing wafer grinding production be covered, but also all the cutting types of quartz wafers can be compatible with the system only through modification of algorithm parameters.

Description

technical field [0001] The invention relates to the technical field of test instruments, in particular to an on-line frequency measurement system for quartz wafer grinding. Background technique [0002] Quartz wafer is the core component of crystal oscillator. Quartz crystal oscillator (crystal oscillator) provides time reference for electronic equipment and plays an extremely important role in the electronic information industry. China is a big manufacturer of crystal oscillators, but there is still a big gap between product grades and total output value compared with developed countries. [0003] The manufacturing process of crystal oscillators can be mainly divided into two stages: chip production and chip packaging. The former mainly processes quartz ingots into chips of specific thickness and size through cutting, grinding and corrosion processes; the latter mainly processes them through silver coating, dispensing, Processes such as fine-tuning and sealing package the ...

AI Technical Summary

Problems solved by technology

[0013] The purpose of the present invention is to solve the technical problem of "jumping frequency measurement value in some frequency bands" of traditional online frequency monitor in the current quartz wafer grinding process.

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