Preparation method for 3D-SiC/Al composite material of 3D interpenetrating structure

A technology of interpenetrating structure and composite material, which is applied in the field of pressureless infiltration preparation of three-dimensional interpenetrating structure 3D-SiC/Al composite material, can solve the problems of high cost and complicated process, improve wettability and reduce interface heat. The effect of resistance and low expansion coefficient

Active Publication Date: 2016-09-07
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this process has the disadvantages of complex process, high cost, and simple shape of formed parts.

Method used

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  • Preparation method for 3D-SiC/Al composite material of 3D interpenetrating structure
  • Preparation method for 3D-SiC/Al composite material of 3D interpenetrating structure
  • Preparation method for 3D-SiC/Al composite material of 3D interpenetrating structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] In this embodiment, the 3D-SiC / Al composite material is made by using SiC powder and aluminum alloy (Al-15Si-10Mg) as main raw materials, and using polycarbosilane as a binder and a sintering aid.

[0030] In this example, the 3D-SiC / Al composite material is prepared according to the following method:

[0031] a. F220 (D50=47μm) SiC micropowder and poly The xylene solution of carbosilane (PCS) is mixed and stirred evenly, wherein the mass of PCS accounts for 8% of the sum of the mass of PCS and SiC micropowder, and silicon carbide powder coated with PCS can be obtained after the xylene volatilizes. Then press it into a SiC biscuit with a pressure of 260MPa on a ceramic tablet press;

[0032] b. Place the SiC biscuit prepared in step a in a tubular atmosphere furnace under the protection of nitrogen and slowly raise the temperature (heating rate 2°C / min) to 700°C for 2 hours, and take samples after cooling to room temperature with the furnace;

[0033] c. Place the SiC b...

Embodiment 2

[0037] In this embodiment, the 3D-SiC / Al composite material is made of SiC powder and aluminum alloy (Al-15Si-10Mg) as the main raw materials, and polycarbosilane as the adhesive and sintering aid.

[0038] In this example, the 3D-SiC / Al composite material is prepared according to the following method:

[0039] a. Mix and stir the pretreated F220 (D50=47 μm) SiC powder, F800 (D50=7.2 μm) SiC powder and polycarbosilane (PCS) xylene solution evenly, wherein the mass of PCS accounts for the mass of PCS and SiC powder and the percentage of 5%. SiC powder coated with PCS can be obtained after xylene volatilizes. Then press it into a SiC biscuit with a pressure of 200MPa on a ceramic tablet press;

[0040] b. Place the SiC biscuit prepared in step a in a tubular atmosphere furnace under the protection of nitrogen and slowly raise the temperature (heating rate 2°C / min) to 1100°C for 1 hour, and take samples after cooling to room temperature with the furnace;

[0041] c. Place the ...

Embodiment 3

[0045] In this embodiment, the 3D-SiC / Al composite material is made by using SiC powder and aluminum alloy (Al-6Si-8Mg) as main raw materials, and using polycarbosilane as a binder and a sintering aid.

[0046] In this example, the 3D-SiC / Al composite material is prepared according to the following method:

[0047] a. Mix and stir the pretreated F220 (D50=47 μm) SiC micropowder and polycarbosilane (PCS) xylene solution according to the designed ratio, wherein the mass of PCS accounts for 5% of the sum of the mass of PCS and SiC micropowder. After xylene volatilizes, silicon carbide powder coated with PCS micropowder can be obtained. Then press it into a SiC biscuit with a pressure of 220MPa on a ceramic tablet press;

[0048] b. Place the SiC biscuit prepared in step a in a tubular atmosphere furnace under the protection of nitrogen and slowly raise the temperature (heating rate 2°C / min) to 600°C for 2 hours, and take samples after cooling to room temperature with the furnace...

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Abstract

The invention relates to a preparation method for a 3D-SiC/Al composite material of a 3D interpenetrating structure. The preparation method for the 3D-SiC/Al composite material of the 3D interpenetrating structure comprises a preparation process of a 3D-SiC prefabricated member and a subsequent pressureless melt infiltration preparation process of the 3D-SiC/Al composite material. When applied to the subsequent pressureless melt infiltration 3D-SiC composite material, the 3D-SiC prefabricated member can be or not be subjected to oxidation pretreatment according to the used aluminum alloy compositions. The content of SiC in the composite material is 50-73 vol%, the density of the composite material can reach up to 2.90-3.1 g/cm<2>, the heat conductivity can reach up to 232 W/(m.DEG C), the coefficient of thermal expansion is as low as 5.72*10<-6>/DEG C, and the bending strength can reach up to 330 Mpa. The overall performance can meet the technical performance requirements, such as a low expansion factor, high heat conductivity and sufficient bending strength, which must be met by electronic packaging materials.

Description

technical field [0001] The invention relates to a method for preparing a SiC / Al composite material, in particular to a method for preparing a pressureless infiltration of a three-dimensional interpenetrating structure 3D-SiC / Al composite material in which both SiC ceramics and aluminum alloys are continuous phases. Background technique [0002] SiC / Al composite materials can be tailored by changing the characteristics, content, distribution, etc. of the aluminum alloy phase and SiC ceramic phase to have tailorable thermophysical properties (such as thermal expansion properties, thermal conductivity) and mechanical properties (strength, etc.), so that It meets the dual-use needs of structure (support) and function (heat dissipation) of electronic packaging materials. Moreover, the SiC / Al composite material has good dimensional stability, high specific strength and specific elastic modulus, and the raw material price is less than 1 / 10 of the currently used high thermal conduct...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22D23/04C22C1/10C22C29/06C22F1/00
CPCC22C1/1015C22C1/1068C22C29/065C22F1/00B22D23/04C22C1/1021
Inventor 吴玉程汪冬梅汤文明郑治祥
Owner HEFEI UNIV OF TECH
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