Reinforcing structure reinforced sapphire substrate and preparation method thereof
A technology of sapphire substrate and reinforcement structure, which is applied in the direction of gaseous chemical plating, coating, instrument, etc., can solve the problems of failure to reach the breaking strength, large fluctuation of value, and not as good as the current one, so as to reduce the thickness of the product and improve the mechanical strength. Strength, cost reduction effect
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Embodiment 1
[0028] A method for preparing a reinforced sapphire substrate comprising the following steps:
[0029] a. Take the sapphire substrate 1 with a thickness of 0.4mm, clean surface and pre-opened circular process hole 2, for standby, and the sapphire substrate is subjected to ultrasonic alkali cleaning, pure water rinsing, ultrasonic pure water rinsing and after The substrate obtained after drying with pure nitrogen at a temperature of 100~200°C;
[0030] b. Put the sapphire substrate 1 into a vacuum chamber, pump the air pressure of the vacuum chamber below 10 Pa, and then feed argon gas with a flow rate of 10 sccm, keep the pressure of the argon gas in the vacuum chamber at 10 Pa, and heat the sapphire substrate 1 to 100°C, Then feed trimethylaluminum vapor into the vacuum chamber, the volume ratio of trimethylaluminum vapor to argon is controlled at 0.1%, and the feeding time of trimethylaluminum vapor is controlled at 0.01 second, so that the molecules of trimethylaluminum Ev...
Embodiment 2
[0039] A method for preparing a reinforced sapphire substrate comprising the following steps:
[0040] a. Take a sapphire substrate 1 with a thickness of 0.4 mm, a clean surface and pre-opened square process holes 2, for standby, and the sapphire substrate 1 is subjected to ultrasonic alkali cleaning, pure water rinsing, ultrasonic pure water rinsing and cleaning in sequence. Substrates after plasma surface treatment;
[0041] b. Put the sapphire substrate 1 into a vacuum chamber, pump the air pressure of the vacuum chamber below 10Pa, and then feed nitrogen gas with a flow rate of 10000 sccm, keep the nitrogen pressure in the vacuum chamber at 5000Pa, heat the sapphire substrate 1 to 500°C, and then Introduce trimethylaluminum vapor into the vacuum chamber, the volume ratio of trimethylaluminum vapor to nitrogen is controlled at 50%, and the introduction time of trimethylaluminum vapor is controlled at 5 seconds, so that the molecules of trimethylaluminum are evenly adsorbed ...
Embodiment 3
[0050] A method for preparing a reinforced sapphire substrate comprising the following steps:
[0051] a. Take a 0.4mm thick sapphire substrate 1 with a clean surface and pre-opened circular process holes 2 for standby, and the sapphire substrate 1 is subjected to ultrasonic alkali cleaning, pure water rinsing, and ultrasonic pure water rinsing in sequence And the substrate obtained after drying with pure nitrogen at a temperature of 100~200°C;
[0052] b. Put the sapphire substrate 1 into a vacuum chamber, pump the vacuum chamber pressure below 10Pa, and then pass in an inert gas with a flow rate of 5000 sccm, keep the pressure of the inert gas in the vacuum chamber at 2500Pa, heat the sapphire substrate 1 to 300°C, Then feed trimethylaluminum vapor into the vacuum chamber, the volume ratio of trimethylaluminum vapor to inert gas is controlled at 25%, and the feeding time of trimethylaluminum vapor is controlled at 3 seconds, so that the molecules of trimethylaluminum Evenly...
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