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An embedded refrigeration device based on a piezoelectric micropump and its preparation method

A refrigeration device and embedded technology, applied in the manufacture/processing of thermoelectric devices, thermoelectric device components, etc., can solve the problems of uneven heat dissipation, large volume, and complex structure of chips, and achieve simple structure, small size, and reduced volume Effect

Inactive Publication Date: 2018-06-19
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
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Problems solved by technology

[0005] In view of the above existing problems or deficiencies, in order to solve the problems of complex structure, bulky, difficult integration, limited application, and uneven heat dissipation of chips, the present invention provides an embedded refrigeration device based on a piezoelectric micropump and its preparation method , using a built-in, simple-structure refrigeration device based on a valveless piezoelectric micropump

Method used

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  • An embedded refrigeration device based on a piezoelectric micropump and its preparation method
  • An embedded refrigeration device based on a piezoelectric micropump and its preparation method
  • An embedded refrigeration device based on a piezoelectric micropump and its preparation method

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Embodiment Construction

[0030] The refrigeration device of the embedded piezoelectric micropump provided in this embodiment includes two parts, such as figure 2 , 3 The microfluidic channel shown and as Figure 4 The specific preparation process of the piezoelectric micropump shown includes the following steps:

[0031] Step 1. Ultrasonic clean three identical Si sheets in acetone, absolute ethanol and deionized water. The Si sheet size is 8mm×5mm and the thickness is 0.5mm, and blow dry with nitrogen to corrode and thin it to 0.3mm.

[0032] Step 2, respectively etch the Si sheets obtained in step 1 to form a corresponding figure 2 , 3 4. The structure of the upper layer of the micro-channel, the lower layer of the micro-channel, the cavity of the piezoelectric micropump, the flow channel and the inlet and outlet shown in 4.

[0033] First, a thin and uniform photoresist layer was spin-coated on the surface of three Si wafers with positive resist; these Si wafers coated with photoresist were p...

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Abstract

The invention belongs to the technical field of microelectronic device integration and heat dissipation, and in particular relates to an embedded refrigeration device based on a piezoelectric micropump and a preparation method thereof. The refrigerating device includes two parts: a micro-channel and a piezoelectric micro-pump; the micro-channel corresponds to a single chip and is arranged under the chip; the piezoelectric micro-pump is placed under the micro-channel. In the present invention, the micro-channel is to dissipate heat for each chip, the size is smaller, and the heat dissipation capability is better; the present invention places the piezoelectric micropump under each chip, which not only reduces the volume of the overall package, but also can The specific power realizes the integration of piezoelectric micropumps with different capabilities and microchannels to form devices with different cooling capabilities, realizing on-demand heat dissipation and improving the uniformity of temperature distribution in the system. The invention has the advantages of simple structure, small volume, easy integration and uniform chip heat dissipation; it can be applied to high-density integrated microsystems, power semiconductor devices and equipment, and the like.

Description

technical field [0001] The invention belongs to the technical field of integration and heat dissipation of microelectronic devices. In particular, it relates to an embedded refrigeration device based on a piezoelectric micropump and a preparation method thereof. Background technique [0002] With the continuous development of microelectronics technology, the line width of integrated circuit technology has been continuously reduced, and the integration level has been significantly improved. The industrialization of new semiconductor power devices such as GaN has further improved the power density of integrated circuit chips, making the chip power and heat generation more and more big. Chips with different power densities are formed into a multi-chip integrated microsystem by means of 3-dimensional integration, so that the thermal characteristics of the system are characterized by a sharp increase in system heating power, non-uniform distribution of local high heat flux hot s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L35/02H01L35/34H10N10/80H10N10/01
CPCH10N10/80H10N10/01
Inventor 罗文博蒲诗睿吴传贵帅垚张万里
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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