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A method of manufacturing a heat pipe in a printed circuit board

A technology of printed circuit boards and heat pipes, which is applied to printed circuits, printed circuits, printed circuit components, etc., can solve problems such as poor heat dissipation, achieve improved heat dissipation efficiency, high-efficiency heat conduction, and improve heat dissipation effects

Inactive Publication Date: 2019-03-19
BEIJING QIHOO TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] For this reason, the present invention proposes a method for manufacturing a heat pipe in a printed circuit board, which solves the technical problem that the printed circuit board produced by the existing printed circuit board has a poor heat dissipation effect, and improves the heat dissipation effect of the printed circuit board

Method used

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  • A method of manufacturing a heat pipe in a printed circuit board
  • A method of manufacturing a heat pipe in a printed circuit board
  • A method of manufacturing a heat pipe in a printed circuit board

Examples

Experimental program
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Effect test

Embodiment

[0049] Example description

[0050] The method for manufacturing the heat pipe in the printed circuit board of the present invention is a method of forming together with the heat pipe used for heat dissipation when manufacturing the printed circuit board. The fiber filaments in the horizontal well of the heat pipe drive the circulation of distilled water to reduce the high temperature of the printed circuit board. The temperature of the zone completes the transfer of heat from the high temperature zone to the low temperature zone, solves the technical problem that the printed circuit board manufactured by the existing printed circuit board has poor heat dissipation effect, and improves the heat dissipation effect of the printed circuit board;

specific Embodiment

[0051] Such as figure 1 As shown, it is a process flow of a method for manufacturing a heat pipe in a printed circuit board according to a specific embodiment of the present invention, including:

[0052] Step S100, fabricating a printed circuit board by thermocompression forming technology according to the structural layout diagram of the printed circuit board, and forming a heat pipe horizontal well in the printed circuit board;

[0053] Step S300, putting fiber filaments into the horizontal well of the heat pipe, welding the sealed well cover to the wellhead of the horizontal well of the heat pipe, and opening a well cover hole on the sealed well cover;

[0054] Step S500, injecting distilled water into the horizontal well of the heat pipe through the hole of the manhole cover and extracting the air in the horizontal well of the heat pipe to seal the hole of the manhole cover.

[0055] Please combine Figure 7 The schematic diagram of the three-dimensional structure of the ...

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Abstract

The invention discloses a method for manufacturing a heat pipe in a printed circuit board. The method comprises the steps as follows: the printed circuit board is manufactured through a hot press molding technology according to a structure layout of the printed circuit board and a heat pipe horizontal well is formed in the printed circuit board; fiber yarns are put into the heat pipe horizontal well and a seal manhole cover is welded at the position of an opening of the heat pipe horizontal well; a manhole cover hole is formed in the seal manhole cover; distilled water is injected into the heat pipe horizontal well through the manhole cover hole and air in the heat pipe horizontal well is extracted; and the manhole cover is sealed. By the method for manufacturing the heat pipe in the printed circuit board, the technical problem that the printed circuit board manufactured by an existing printed circuit board has a relatively poor cooling effect is solved; and the cooling effect of the printed circuit board is improved.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a method for manufacturing heat pipes in printed circuit boards. Background technique [0002] Printed Circuit Board (PCB for short) is a provider of electrical connections for electronic components. The main advantage of printed circuit boards is to greatly reduce the errors of wiring and assembly, and improve the level of automation and production labor rate. According to the number of layers of circuit boards, it can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards. [0003] And, with the development of Moore's Law, the number of circuits integrated in the chip is increasing; the progress of electronic manufacturing technology also makes the number of circuits integrated on the PCB per unit area continue to increase. This makes the heat dissipation of the PCB a major obstacle to the improv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/30H05K1/02
CPCH05K1/0203H05K3/30H05K2201/10416
Inventor 李帅
Owner BEIJING QIHOO TECH CO LTD