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Negative photosensitive resin composition, resin cured film, partition wall, and optical element

A technology of photosensitive resin and optical components, which is applied in the direction of optics, electrical components, and electric solid devices, etc., which can solve the problem of increasing development residue at the opening and achieve high precision and good ink repellency

Active Publication Date: 2016-10-12
ASAHI GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the manufacture of organic EL elements, quantum dot displays, TFT arrays, and thin-film solar cells, it is increasingly required to form finer and higher-precision patterns at a level that is difficult to achieve with the techniques described in Patent Document 1 and Patent Document 2.
Then, when an attempt is made to adjust the composition of the photosensitive resin composition to form a partition wall having ink repellency on the upper surface for the purpose of forming a partition wall for forming a fine and high-precision pattern, the development residue in the opening portion becomes many questions

Method used

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  • Negative photosensitive resin composition, resin cured film, partition wall, and optical element
  • Negative photosensitive resin composition, resin cured film, partition wall, and optical element
  • Negative photosensitive resin composition, resin cured film, partition wall, and optical element

Examples

Experimental program
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Embodiment

[0187] Hereinafter, the present invention will be described in more detail using examples, but the present invention is not limited to these examples. In addition, Examples 1-15 are examples, and Examples 16-18 are comparative examples.

[0188] Each measurement was performed according to the following method.

[0189] [Number average molecular weight (Mn) and mass average molecular weight (Mw)]

[0190] Using a commercially available GPC measuring device (manufactured by Tosoh Corporation, device name: HLC-8320GPC), the gel of various monodisperse polystyrene polymers with different degrees of polymerization commercially available as a standard sample for molecular weight measurement was measured. Permeation Chromatography (GPC). A standard curve was prepared according to the relationship between the molecular weight of polystyrene and the retention time.

[0191] After each sample was diluted to 1.0% by mass with tetrahydrofuran and passed through a 0.5 μm filter, GPC was...

Synthetic example 1

[0255] (Synthesis Example 1: Preparation of Ink Repellent Agent (E1-1) Liquid)

[0256] At 1,000cm equipped with a mixer 3 Compound (ex-11), compound (ex-21), and compound (ex-31) were added to a three-necked flask to obtain a hydrolyzable silane compound mixture. Next, PGME was added to this mixture as a raw material solution.

[0257] A 1% aqueous hydrochloric acid solution was added dropwise to the obtained raw material solution. After completion|finish of dripping, it stirred at 40 degreeC for 5 hours, and obtained the PGME solution (ink repellent agent (E1-1) concentration: 10 mass %) of the ink repellent agent (E1-1).

[0258] It should be noted that after the completion of the reaction, the components of the reaction solution were measured using gas chromatography, and it was confirmed that each compound used as a raw material was below the detection limit. Table 1 shows the feed-amount etc. of the raw material hydrolyzable silane compound used for manufacture of the...

Synthetic example 2～10

[0259] (Synthesis examples 2 to 10: Synthesis of ink repellent agents (E1-2) to (E1-10))

[0260] Except having made the raw material composition into Table 1, it carried out similarly to the synthesis example 1, and obtained the solution (all compound density|concentrations of 10 mass %) of ink repellent agents (E1-2)-(E1-10).

[0261] Table 2 shows the results of measuring Mn, Mw, the content of fluorine atoms, the content of C=C, and the acid value of the ink repellent agents obtained in Synthesis Examples 1-10.

[0262] [Table 1]

[0263]

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Abstract

Provided are a negative photosensitive resin composition for an optical element having favorable ink repellency and capable of reducing a residue at an opening section, a resin cured film for an optical element having favorable ink repellency, a partition wall for an optical element capable of forming a high-precision pattern, and an optical element having the partition wall. A negative photosensitive resin composition containing a photocurable alkali-soluble resin or alkali-soluble monomer (A), a photopolymerization initiator (B), a reactive ultraviolet absorber (C), a polymerization inhibitor (D), and an ink repellent agent (E); a cured film and a partition wall formed using the negative photosensitive resin composition; or an organic EL element, a quantum dot display, a TFT array, or a thin-film solar cell having multiple dots and the partition walls positioned between the adjacent dots on the surface of a substrate.

Description

technical field [0001] The present invention relates to a negative photosensitive resin composition, a cured resin film, a partition wall and an optical element used in an organic EL element, a quantum dot display, a TFT array, or a thin film solar cell. Background technique [0002] In the manufacture of optical components such as organic EL (Electro-Luminescence; electroluminescence) elements, quantum dot displays, TFT (Thin Film Transistor; thin film transistor) arrays, and thin-film solar cells, sometimes organic layers such as light-emitting layers are used as dots, sprayed A method of pattern printing by the ink (IJ) method. In the method described above, a partition wall is provided along the outline of the dot to be formed, and ink containing an organic layer material is injected into a section (hereinafter referred to as "opening") surrounded by the partition wall to perform Drying and / or heating, etc., thereby forming dots of a desired pattern. [0003] In the ca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B33/22G03F7/004G03F7/038H01L21/312H01L21/336H01L29/786H01L51/44H01L51/46H01L51/50H05B33/12H10K99/00
CPCG03F7/038G03F7/0046G03F7/027G03F7/031G03F7/0388Y02E10/549H10K59/122H10K71/191H10K10/88H10K30/88H10K30/50G03F7/0382H10K10/488H10K30/30H10K50/11H10K71/135H10K2102/341G03F7/0752
Inventor 永井雄介高桥秀幸川岛正行
Owner ASAHI GLASS CO LTD