Preparation method and application of rough cus nanosheet arrays on the surface of nickel foam
A nanosheet array, nickel foam technology, applied in the manufacture of hybrid/electric double layer capacitors, hybrid capacitor electrodes, etc., can solve the problems of low specific capacitance value and poor cycle stability, and achieve high specific capacitance value, good performance, increased The effect of large specific surface area
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Embodiment 1
[0029] A preparation method for generating rough CuS nanosheet arrays on the surface of nickel foam, comprising the steps of:
[0030] Step 1. Pretreatment of foamed nickel: first put the cut foamed nickel into 3mol L -1 In the HCl solution, use an ultrasonic cleaner with an ultrasonic frequency of 50 Hz to ultrasonically clean for 20 minutes, wash with deionized water for 5 times, and vacuum-dry at 60°C for 3 hours, and set aside;
[0031] Step 2, generate copper monolayer material on the surface of foamed nickel: put a piece of cleaned foamed nickel prepared in step 1 into 0.5mol L of 15mL -1 CuCl 2 In the solution, a displacement reaction was carried out at 30°C for 0.5h, after the reaction, it was washed 5 times with deionized water, and vacuum-dried at 80°C for 3h, and the material for forming a single layer of copper on the surface of the nickel foam was obtained by the displacement reaction;
[0032] Step 3: Prepare rough CuS nanosheet arrays by hydrothermal method, a...
Embodiment 2
[0034] A preparation method for generating rough CuS nanosheet arrays on the surface of nickel foam, comprising the steps of:
[0035] Step 1: Pretreatment of foamed nickel, first put the cut foamed nickel into 3mol L -1 In the HCl solution, use an ultrasonic cleaner with an ultrasonic frequency of 50 Hz to ultrasonically clean for 30 minutes, wash with deionized water for 5 times, and vacuum-dry at 60°C for 3 hours, and set aside;
[0036] Step 2, generate copper monolayer material on the surface of foamed nickel, put a piece of cleaned foamed nickel prepared in step 1 into 0.5mol L of 15mL -1 CuCl 2 In the solution, a displacement reaction was carried out at 30°C for 0.5h, after the reaction, it was washed 5 times with deionized water, and vacuum-dried at 80°C for 3h, and the material for forming a single layer of copper on the surface of the nickel foam was obtained by the displacement reaction;
[0037]Step 3: Prepare rough CuS nanosheet arrays by hydrothermal method, ad...
Embodiment 3
[0039] A preparation method for generating rough CuS nanosheet arrays on the surface of nickel foam, comprising the steps of:
[0040] Step 1: Pretreatment of foamed nickel, first put the cut foamed nickel into 3mol L -1 In HCl, use an ultrasonic cleaner with an ultrasonic frequency of 50 Hz to ultrasonically clean for 30 minutes, wash with deionized water for 5 times, and vacuum-dry at 60°C for 3 hours, and set aside;
[0041] Step 2, generate copper monolayer material on the surface of foamed nickel, put a piece of cleaned foamed nickel prepared in step 1 into 0.5mol L of 15mL -1 CuCl 2 In the solution, a displacement reaction was carried out at 30°C for 0.5h, after the reaction, it was washed 5 times with deionized water, and vacuum-dried at 60°C for 3h, and the material for forming a single layer of copper on the surface of the nickel foam was obtained by the displacement reaction;
[0042] Step 3: Prepare rough CuS nanosheet arrays by hydrothermal method, add 0.03g of s...
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