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Microcapsule-type curable resin composition

一种固化性树脂、组合物的技术，应用在环氧树脂胶、粘合剂类型、黏合剂添加剂等方向，能够解决没有显示固化剂内包、无法发挥液态组合物效果等问题，达到优异固定力和保存稳定性、优异保存稳定性、优异固定力的效果

Active Publication Date: 2016-10-26
THREE BOND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the curing agent must exert adhesiveness between the above-mentioned microcapsules and the adherend, and when the curing agent is contained in the microcapsules, the above-mentioned effects of the liquid composition for screw groove coating cannot be exerted.
Therefore, there is no technical idea of ​​enclosing the curing agent in microcapsules in Patent Document 4
In addition, there is no description in Patent Document 4 that it is possible to encapsulate a curing agent in microcapsules.

Method used

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  • Microcapsule-type curable resin composition
  • Microcapsule-type curable resin composition
  • Microcapsule-type curable resin composition

Examples

Experimental program
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Effect test

preparation example Construction

[0046] The microcapsule containing the compound (a) having three or more thiol groups can be produced by a known method. For example, it can be prepared by the methods described in JP-A-53-84881 and JP-A-2000-15087. That is, a method for preparing microcapsules, the method comprising: preparing an aqueous dispersion containing a salt of methylolmelamine, an isobutylene-maleic anhydride copolymer and a compound (a) having more than 3 thiol groups; In the aqueous dispersion, the methylolmelamine is polycondensed under acidic conditions. Here, the methylolmelamine used as a raw material of the melamine resin constituting the microcapsule wall is an initial condensation product of melamine and formaldehyde, and can be prepared from melamine and formaldehyde by a conventional method. A commercial item can also be used as this methylolmelamine. In addition, the isobutylene-maleic anhydride copolymer can be produced by a conventional method using isobutylene and maleic anhydride. ...

Embodiment 1

[0100] Preparation of microcapsules containing component (a)

[0101] As the component (a), pentaerythritol tetrakis-3-mercaptopropionate (number of thiol groups: 4) was used. On the other hand, an initial condensate of methylolmelamine (BECKAMINE M-3 manufactured by DIC Corporation, concentration: 80%) was used as a microcapsule wall material.

[0102] 12 g of isobutylene-maleic anhydride copolymer [Isobam 110 (trademark) manufactured by KURARAY Co., Ltd.] was added to 30 g of water, and the temperature was raised to 40°C while stirring in a pressurized container, and a 10% tartaric acid aqueous solution was added dropwise thereto. , adjust the pH value to the range of 3.0-4.0. Then, 125 g of the above-mentioned component (a) pentaerythritol tetra-3-mercaptopropionate was added to this aqueous solution, and this was stirred at room temperature to prepare an aqueous dispersion. At this time, by appropriately adjusting the stirring time and stirring speed, microcapsules hav...

Embodiment 2

[0110] In addition to using 1,3,5-tris(3-mercaptobutoxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione (number of thiol groups: 3 1) The same operation as in Example 1 was carried out except that a microcapsule enclosing the component (a) was prepared as the component (a). Various physical properties were evaluated using the obtained microcapsule type curable resin composition and precoated bolts.

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Abstract

The present invention provides a microcapsule-type curable resin composition which enables the mass production of microcapsules each encapsulating a curing agent and therefore can be produced at significantly low cost, and which has an excellent adhesion property and excellent storage stability. Particularly provided is a microcapsule-type curable resin composition which can exhibit excellent low-temperature curability and an excellent curing rate when used for a screw member such as a screw and can exhibit a significantly superior effect when used for preventing the looseness of screws. The present invention is a microcapsule-type curable resin composition comprising: microcapsules each encapsulating (a) a compound having at least three thiol groups; (b) a substance capable of being cured by reacting with the compound having at least three thiol groups; and (c) a binder capable of adhering the microcapsules to a material of interest. The curable resin composition can be used preferably for the adhesion of a screw member.

Description

technical field [0001] The present invention relates to a microcapsule-type curable resin composition, and more specifically, to a microcapsule-type curable resin composition used for fixing, loosening, and the like of threaded members (screw-type fastening fixtures) such as screws, for example. Background technique [0002] Conventionally, microcapsule-type adhesives for bonding threaded parts such as screws, bolts, nuts, and screws are widely known. For example, it can be cited: a microcapsule adhesive for anti-loosening, characterized in that it contains microcapsules (A), an adhesive (B) made of water-soluble polyacetal resin, and a non-volatile and A water-soluble or water-dispersible amine-based curing agent (C), the microcapsule (A) is formed using an epoxy resin as a core material and an aldehyde-based resin or a urea-based resin as a wall material (Patent Document 1 ); a microcapsule adhesive composition comprising: microcapsules (A) containing epoxy resins as core...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/66C08L33/06C08L63/00C09J11/06C09J133/04C09J163/00C09J163/02C09J201/00
CPCC08G59/66C08K9/10C08L33/08C08J3/241C09J163/00
Inventor 镰田邦彦久保山健二
Owner THREE BOND CO LTD