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Anisotropic conductive adhesive

A conductive adhesive, anisotropic technology, applied in the direction of conductive adhesives, adhesives, conductive materials, etc., can solve problems such as poor connection reliability, achieve increased contact area, high light reflectivity, and excellent heat release characteristics Effect

Active Publication Date: 2016-10-26
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

like Image 6 , Figure 9 As shown, in the case of connecting the electrodes with the conductive paste 303a, 303b, heat can be efficiently released, but as described above, the connection reliability of the connection using the conductive paste 303a, 303b is poor.
Additionally, if Figure 8 As shown, in the case of gold-tin eutectic bonding, the same as above, the connection reliability is also poor.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0101] As shown in Table 1, with respect to the Ag alloy (Ag:Bi:Nd=99:0.7:0.3) for binder mixing, the appearance obtained by coating the surface of the Ni-plated resin particles is gray light-reflective conductive particles (particle size ( D50): 5.5 μm), flux particles (particle size (D50): 5.0 μm), and titanium oxide (particle size (D50): 0.25 μm), to prepare an anisotropic conductive adhesive.

[0102] The reflectance of the anisotropic conductive adhesive is 65% at a wavelength of 450nm. In addition, the total luminous flux of the LED mounting body prepared using anisotropic conductive adhesive is 7.0lm, and the thermal resistance value of the electrical connection part is 13.2°C / W, which can be improved compared with the conventional ACP (such as Comparative Example 1). Optical and exothermic properties. In addition, the initial evaluation of the conduction reliability of the LED package was ○, and the evaluation after the 85°C 85% 3000h lighting test was ○, and stable e...

Embodiment 2

[0104]As shown in Table 1, with respect to the Ag alloy (Ag:Bi:Nd=99:0.7:0.3) for binder mixing, the appearance obtained by coating the surface of the Ni-plated resin particles is gray light-reflective conductive particles (particle size ( D50): 5.5 μm), flux particles (particle size (D50): 1.1 μm), and titanium oxide (particle size (D50): 0.25 μm), to prepare an anisotropic conductive adhesive.

[0105] The reflectance of the anisotropic conductive adhesive is 60% at a wavelength of 450nm. In addition, the total luminous flux of the LED mounting body prepared using anisotropic conductive adhesive is 6.5lm, and the thermal resistance value of the electrical connection part is 13.6°C / W, which can be improved compared with the conventional ACP (such as Comparative Example 1). Optical and exothermic properties. In addition, the initial evaluation of the conduction reliability of the LED package was ○, and the evaluation after the 85°C 85% 3000h lighting test was ○, and stable el...

Embodiment 3

[0107] As shown in Table 1, with respect to the Ag alloy (Ag:Bi:Nd=99:0.7:0.3) for binder mixing, the appearance obtained by coating the surface of the Ni-plated resin particles is gray light-reflective conductive particles (particle size ( D50): 5.5 μm), flux particles (particle size (D50): 5.0 μm), and titanium oxide (particle size (D50): 0.18 μm), to prepare an anisotropic conductive adhesive.

[0108] The reflectance of the anisotropic conductive adhesive is 55% at a wavelength of 450nm. In addition, the total luminous flux of the LED mounting body prepared using anisotropic conductive adhesive is 6.0lm, and the thermal resistance value of the electrical connection part is 12.5°C / W, which can be improved compared with the conventional ACP (such as Comparative Example 1). Optical and exothermic properties. In addition, the initial evaluation of the conduction reliability of the LED package was ○, and the evaluation after the 85°C 85% 3000h lighting test was ○, and stable e...

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Abstract

Provided is an anisotropic conductive adhesive which enables the achievement of excellent optical characteristics and excellent heat dissipation characteristics. This anisotropic conductive adhesive contains: conductive particles (31), each of which is obtained by forming a metal layer that is mainly composed of Ag on the outermost surface of a resin particle; solder particles (32) which have a smaller average particle diameter than the conductive particles; light-reflecting insulating particles which have a smaller average particle diameter than the solder particles; and a binder in which the conductive particles (31), the solder particles (32) and the light-reflecting insulating particles are dispersed. The conductive particles and the light-reflecting insulating particles efficiently reflect light, thereby improving the light extraction efficiency of an LED package. In addition, since terminals are solder bonded with each other by means of the solder particles (32) during compression bonding, the contact area between terminals facing each other is increased, thereby enabling the achievement of high heat dissipation characteristics.

Description

technical field [0001] The present invention relates to an anisotropic conductive adhesive dispersed with conductive particles, and in particular relates to heat dissipation from chips (elements) such as LEDs (Light Emitting Diodes) and driver ICs (Integrated Circuits). Thermal anisotropic conductive adhesive. This application claims priority on the basis of Japanese Patent Application No. Japanese Patent Application No. 2014-56263 for which it applied in Japan on March 19, 2014, and takes in this application by referring this application. Background technique [0002] Conventionally, a wire bonding method has been used as a method of mounting an LED element on a substrate. Wire bonding methods such as Figure 5 As shown, the electrodes of the LED element (the first conductivity type electrode 104a and the second conductivity type electrode 102a) are facing upward (facing upward), and the LED element and the substrate are electrically bonded by wire bonding (WB) 301a, 301b,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J201/00C09J9/02C09J11/04H01B1/00H01B1/22H01B5/16H01L21/60H05K1/18H05K3/32H05K3/34
CPCC09J11/04H01B1/22H01L2224/32225H01L2224/49107H01L2224/73204H01L2224/48091H01L2224/48227H01L2224/73265C08K3/22C08K7/16C08K2003/0806C08K2201/001C08K2201/005H05K3/323H05K2201/0221H05K2201/0272H05K2201/10106H05K2201/2054H01L2224/2939H01L2224/29439H01L24/29H01L24/81H01L24/83H01L2224/16238H01L2224/2929H01L2224/293H01L2224/29386H01L2224/29499H01L2224/81193H01L2224/81194H01L2224/81203H01L33/60H01L33/62C09J9/02H01L2924/00014H01L2924/014H01L2924/05341H01L2924/05432H01L2924/00012H01L2224/16225C08K9/02H01B1/00H01L33/641C09J2301/50C09J2301/314C09J201/00C08K2003/2241C08K2201/003C09J163/00H01L33/644H01L33/647H01L2933/0066H01L2933/0075H01L2924/00
Inventor 波木秀次蟹泽士行石神明青木正治
Owner DEXERIALS CORP