Epoxy resin-based plastic encapsulant containing fluorescent powder, preparation method and application of improving the bin rate of LED white light chips

Abstract

The invention discloses an epoxy resin matrix molding compound, a preparation method and application thereof for improving LED white light chip Bin drop rate. The preparation method of the epoxy resin matrix molding compound containing fluorescent powder comprises the steps of: (1) taking bisphenol A epoxy resin and 2, 6-ditert-butyl-4-methylphenol, and performing stirring; adding diol and hydroxyl terminated polybutadiene to carry out reaction, and adding acid anhydride to carry out reaction so as to obtain a mixture; (2) taking LED fluorescent powder and a silane coupling agent to carry out reaction so as to obtain modified LED fluorescent powder; and (3) reacting an adhesion force promoter, an antioxidant and a dispersant with the mixture and the modified LED fluorescent powder, adding acid anhydride and a catalyst, and carrying out stirring and reaction to obtain powder; and performing cake making so as to obtain the epoxy resin matrix molding compound containing fluorescent powder. The molding compound provided by the invention can be applied in chip packaging, the process is simplified, the production efficiency is improved, the rate of finished products is increased and the production cost is greatly reduced.

Description

Technical field [0001] The invention belongs to the field of LED packaging materials, and relates to an epoxy resin-based plastic encapsulant containing fluorescent powder, a preparation method and an application for improving the Bin rate of LED white light chips. Background technique [0002] Light Emitting Diode (Light Emitting Diode, hereinafter referred to as LED) is a type of light-emitting element that can directly convert electrical energy into light energy. It has low working voltage, low power consumption, high luminous efficiency, extremely short luminous response time, and pure light color. , Strong structure, impact resistance, vibration resistance, stable and reliable performance, light weight, small size and low cost, etc., which have been widely used and developed by leaps and bounds, such as applications in lighting and display screens. [0003] In order to manufacture high-performance, high-power, high-low-bin rate or outdoor LED devices, the requirements for chip...

AI Technical Summary

Problems solved by technology

When packaging LED chips, the difference in the amount and distribution of phosphor covering the surface of the LED chip will lead to differences in Bin

Especially when dispensing glue, a slight change in the amount of silica gel or epoxy resin containing phosphor, as well as the sedimentation of the phosphor, will lead to changes in the amount of phosphor covering the surface of the LED chip, which will directly affect the lighting quality of the chip and cause light loss. The strong distribution is scattered, and the bin rate is very low, especially the bin rate of white light chips is very low

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