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Preparation method of microcapsule battery composite polyimide dielectric material

A composite polyimide intermediary and microcapsule technology, which is applied in the direction of microcapsule preparation, microsphere preparation, gel preparation, etc., can solve the problems of large dielectric loss, decreased mechanical properties, poor mechanical properties, etc., and achieve environmentally friendly Pollution, the effect of simple preparation process

Active Publication Date: 2016-11-16
安达市易渡化学有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention: Aiming at the defect that the dielectric loss of the polyimide dielectric composite material prepared at present is very large, and its mechanical properties are greatly reduced when the filling amount is high, a method is provided by adding polystyrene sulfonate Then polymerize with pyrrole to prepare hollow microcapsules, then fill the interior of the microcapsules with aniline, and then plate silver with nano-copper powder on the surface to form a microcapsule-type battery structure, and fill the polyimide material through the microcapsule battery. While greatly increasing its dielectric constant, it effectively improves the toughness and strength of polyimide, and effectively solves the defects of large dielectric loss and poor mechanical properties of polyimide dielectric composite materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0020] First, stir and mix the polystyrene resin particles with 85% concentrated sulfuric acid by mass at a mass ratio of 1:5, and ultrasonically disperse them at 200W to make them sulfonated for 10 minutes. Then, filter and collect the filter cake with a mass concentration of 10%. After washing with sulfuric acid solution 3 times, then washing with deionized water 3 times, drying at 65°C for 6 hours to prepare sulfonated polystyrene resin particles; in parts by weight, weigh 5 parts of 20% persulfuric acid by weight. Ammonium solution, 30 parts of sulfonated polystyrene resin particles prepared above, 10 parts of nano copper powder and 60 parts of deionized water were placed in a three-necked flask, stirred and mixed and placed at 65°C for preheating for 25 minutes; after preheating was completed , Pyrrole with the same quality of ammonium persulfate solution was added dropwise to it, and the dropping time was controlled to 10min. After the dropping was completed, it was heated...

example 2

[0022] First, stir and mix the polystyrene resin particles with 85% concentrated sulfuric acid by mass at a mass ratio of 1:5, and ultrasonically disperse them at 250W to make them sulfonated for 12 minutes. Then, filter and collect the filter cake with a mass concentration of 10%. After washing 4 times with sulfuric acid solution, washing 4 times with deionized water and drying at 70℃ for 7 hours, the sulfonated polystyrene resin particles were prepared. In parts by weight, weigh 7 parts of 20% persulfuric acid by weight. Ammonium solution, 22 parts of sulfonated polystyrene resin particles prepared above, 8 parts of nano copper powder and 50 parts of deionized water were placed in a three-necked flask, stirred and mixed and placed at 70°C for preheating for 27 minutes; after preheating was completed , Pyrrole with the same quality of ammonium persulfate solution was added dropwise to it, and the dropping time was controlled to 12 minutes. After the dropping was completed, it w...

example 3

[0024] First, according to the mass ratio of 1:5, stir and mix the polystyrene resin particles with 85% concentrated sulfuric acid by mass, and ultrasonically disperse them at 300W to make it sulfonated for 15 minutes, then suction filter and collect the filter cake, with a mass concentration of 10% After washing 5 times with sulfuric acid solution, washing 5 times with deionized water, drying at 80°C for 8 hours to prepare sulfonated polystyrene resin particles; In parts by weight, weigh 10 parts of persulfuric acid with a mass concentration of 20% Ammonium solution, 30 parts of sulfonated polystyrene resin particles prepared above, 10 parts of nano-copper powder and 60 parts of deionized water were placed in a three-necked flask, stirred and mixed and placed at 80°C for preheating for 30 minutes; after preheating was completed , Add pyrrole with the same quality of ammonium persulfate solution to it, and control the dropping time to 15min. After the dropping is completed, heat...

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Abstract

The present invention relates to a preparation method of microcapsule battery composite polyimide dielectric material and belongs to the technical field of preparation of dielectric materials. The present invention is directed to overcome the defect that presently prepared polyimide dielectric composite material has high dielectric loss and greatly reduced mechanical properties in case of high filling quantity, polystyrene is sulfonated and then polymerized with pyrrole to prepare hollow microcapsules, and the microcapsules are then filled with phenylamine and are then silver-coated with surface nano copper powder to form a microcapsule battery structure; by filling the microcapsule battery with polyimide material, dielectric constant of the battery is greatly increased, with the toughness and strength of polyimide effectively improved; the microcapsule battery composite polyimide dielectric material prepared herein is up to 135 in dielectric constant and up to 280 KJ / m<2> in impact strength, and the preparation process is simple and green and is environmentally friendly.

Description

Technical field [0001] The invention relates to a preparation method of a microcapsule battery composite polyimide dielectric material, and belongs to the technical field of dielectric material preparation. Background technique [0002] High-electricity material is a kind of insulating material with very broad application prospects. Because of its good performance in storing electric energy and uniform electric field, it has very important applications in the electronics, electrical machinery and cable industries. Polyimide is widely used in microelectronics high-tech fields and aerospace fields based on the excellent thermal properties, mechanical properties, dielectric properties and other unmatched advantages of other polymers. Due to the designability of its structure, more and more researchers in the world have invested in the research and development of such high-tech materials. However, with the research of materials, the direction of high performance, multi-function and ...

Claims

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Application Information

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IPC IPC(8): B01J13/02C08G73/06
CPCB01J13/0065B01J13/02C08G73/0611
Inventor 陈建峰高玉刚
Owner 安达市易渡化学有限公司
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