Carbon nanotube heat conduction CPU radiator

Abstract

The invention provides a carbon nanotube heat conduction CPU radiator comprising a radiation body and a radiation fan; the radiation body comprises radiation fins and a heat conducting agent; the heat conducing agent refers to the carbon nanotube heat conducting agent formed by the following ingredients by weight parts: heat conduction silica gel 30-40 parts, carbon nanotube 3-9 parts, silane coupling agent 2-6 parts, polyethylene wax 2-6 parts, TNEDIS 3.6-10.8 parts, boron nitride 6-10 parts, alumina 6-10 parts, silver powder 2-4 parts, and powdered steatile 15-25 parts. The CPU radiator is compact in structure, highly efficient in heat radiation, reasonable ingredient proportion is employed, and the heat conduction silica gel and carbon nanotube are composited, thus providing high heat conduction coefficient and heat conduction heat radiation effect; filling material amount is reasonably used; the carbon nanotube heat conduction CPU radiator is low in thermal impedance, excellent in coating property and laying performance, and insulating properties can be simultaneously ensured.

Description

Technical field [0001] The invention belongs to the field of electronic device heat sink equipment, and in particular relates to a CPU heat sink with carbon nanotube heat conduction. Background technique [0002] With the high power and high integration of integrated circuits, the assembly density of electronic components continues to increase and the geometric size of the equipment continues to shrink, and its energy consumption output increases sharply. Therefore, in order to ensure the operating reliability and long service life of sensitive devices, the research on thermally conductive insulating materials that can discharge the heat generated by heat-generating electronic components in time is becoming more and more important. [0003] The CPU is a very large-scale integrated circuit, which is the computing and control core of the computer. With the continuous development of computers, CPUs continue to be updated, and the number of transistors in the CPUs continues to increas...

AI Technical Summary

Problems solved by technology

However, in the actual use process, the contact surface of the three layers of CPU-silicon grease-heat sink cannot reach the ideal flat surface after bonding, and there is still air in the interface gap, which increases the interface thermal resistance and seriously hinders heat conduction. Moreover, in the process of applying silicone grease, the thickness of the application of silicone grease cannot be well controlled, which affects the overall heat dissipation effect, resulting in unsatisfactory heat conduction and heat dissipation efficiency