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Self-repairing flexible printed circuit board and preparation method thereof

A flexible printed circuit, self-healing technology, applied in flexible printed circuit boards, printed circuits, printed circuit components, etc., can solve problems such as performance degradation and scrapping, and achieve low cost, excellent mechanical properties, and simple and easy preparation methods. row effect

Inactive Publication Date: 2016-11-23
JIANGNAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The circuit board of the present invention uses an elastomer with self-repairing properties as the substrate, and the raw materials required for the elastomer substrate have been commercialized, are cheap and easy to obtain, and can greatly reduce the cost of the circuit board; at the same time, the present invention endows the circuit board with self-repairing Performance, which can solve the problem of performance degradation and scrapping of traditional printed circuit boards after being damaged during use, and extend the service cycle and service life of materials

Method used

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  • Self-repairing flexible printed circuit board and preparation method thereof
  • Self-repairing flexible printed circuit board and preparation method thereof
  • Self-repairing flexible printed circuit board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A method for preparing a self-repairing flexible printed circuit board, said method comprising the following steps:

[0030] (1) Put 9g of N,N-dimethylacrylamide, 1g of 2-hydroxyethyl acrylate, 0.25g of borax, 4g of water and 0.05g of 2,2-diethoxyacetophenone into the container in proportion, and use The mixer was shaken and stirred for 5 minutes, and then nitrogen gas was passed into the solution for 3 minutes;

[0031] (2) Place the mixed solution obtained in step (1) in a self-made mold, and use a 254nm ultraviolet lamp to irradiate for 18 minutes to obtain a self-healing hydrogel elastomer based on a borate bond;

[0032] (3) Using the self-healing hydrogel elastomer based on borate ester bonds obtained in step (2) as a base material, the self-healing flexible printed circuit board can be obtained through printed circuit technology.

[0033] The self-made mold is made by sandwiching a silicone ring between two glass plates, the size of the glass plate is 30mm×75mm×...

Embodiment 2

[0035] A method for preparing a self-repairing flexible printed circuit board, said method comprising the following steps:

[0036] (1) Put 7g of N,N-dimethylacrylamide, 3g of hydroxyethyl methacrylate, 0.75g of borax, 4g of water and 0.05g of 2,2-diethoxyacetophenone into the container in proportion, and use a mixing Shake and stir for 10 minutes with a homogenizer, and then pass nitrogen gas into the solution for 5 minutes;

[0037] (2) Place the mixed solution obtained in step (1) in a self-made mold, and use a 254nm ultraviolet lamp to irradiate for 15 minutes to obtain a self-healing hydrogel elastomer based on a borate bond;

[0038] (3) Using the self-healing hydrogel elastomer based on borate ester bonds obtained in step (2) as a base material, the self-healing flexible printed circuit board can be obtained through printed circuit technology.

[0039] The self-made mold is made by sandwiching a silicone ring between two glass plates, the size of the glass plate is 30m...

Embodiment 3

[0041] A method for preparing a self-repairing flexible printed circuit board, said method comprising the following steps:

[0042] (1) Put 5g of acrylamide, 5g of hydroxypropyl methacrylate, 1.25g of borax, 6g of water and 0.05g of 2,2-diethoxyacetophenone into the container in proportion, and use a mixer to shake and stir for 8min. Nitrogen was passed through the solution for 4 minutes;

[0043] (2) Place the mixed solution obtained in step (1) in a self-made mold, and use a 254nm ultraviolet lamp to irradiate for 20 minutes to obtain a self-healing hydrogel elastomer based on a borate bond;

[0044] (3) Using the self-healing hydrogel elastomer based on borate ester bonds obtained in step (2) as a base material, the self-healing flexible printed circuit board can be obtained through printed circuit technology.

[0045] The self-made mold is made by sandwiching a silicone ring between two glass plates, the size of the glass plate is 30mm×75mm×1mm, and the thickness of the s...

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Abstract

The invention discloses a self-repairing flexible printed circuit board and a preparation method thereof. A base material of the circuit board is prepared from self-repairing hydrogel elastomers based on dynamic boric acid ester bonds and prepared from, by weight, 30-70 parts of hydrophilic group containing allyl monomers or polymers, 5-35 parts of hydroxide group containing allyl monomers or polymers, 2-8 parts of boron compounds, 15-35 parts of water and 0.5-1 part of radical initiator. The hydrogel elastomers achieve a self-repairing function through dynamic boric acid ester bonds formed by hydroxide groups and boric acid radicals, the boric acid ester bonds serve as dynamic covalent bonds, the strength of covalent bonds and the reversibility and plasticity of physical crosslinking are achieved, therefore, the material achieves the self-repairing performance, and the service life of the material is prolonged. Meanwhile, the raw materials are cheap and easy to obtain, the preparation process is simple, and good comprehensive mechanical performance is achieved.

Description

technical field [0001] The invention relates to the technical field of functional polymer materials, in particular to a self-repairing flexible printed circuit board and a preparation method thereof. Background technique [0002] The traditional flexible circuit board (FPC) is made of polyimide or polyester film, which has many advantages that rigid printed circuit boards do not have, such as it can be bent, wound, and folded freely. The use of FPC can greatly reduce the volume of electronic products, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communications, laptop computers, computer peripherals, PDA, digital cameras and other fields or products. Flexible printed circuit boards are divided into single-sided, double-sided and multi-layer boards. The base material used is mainly polyimide copper clad laminate, and the ...

Claims

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Application Information

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IPC IPC(8): C08F220/54C08F220/56C08F220/26C08F220/28C08F283/06C08F2/48C08J3/075C08J3/24H05K1/03C08L33/26C08L33/24C08L51/08
CPCC08F2/48C08F220/28C08F220/281C08F220/54C08F220/56C08F283/065C08J3/075C08J3/24C08J2333/24C08J2333/26C08J2351/08H05K1/0353H05K2201/05
Inventor 张洪吉陈益鸣陈明清东为富施冬键李小杰陆可钰
Owner JIANGNAN UNIV
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