Flat bump type non-metal cutting package process and package structure thereof

A planar bump type and packaging technology, which is applied in semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve problems such as poor reliability and fast tool wear, and achieve small cutting stress, simple process, and reliable chips sex enhancing effect

Active Publication Date: 2016-11-23
CHANGJIANG ELECTRONICS TECH CHUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Aiming at the problems of easy delamination, poor reliability, and fast tool wear in the existing technology, the present invention provides a planar bump type metal-free cutting packaging process and its packaging structure

Method used

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  • Flat bump type non-metal cutting package process and package structure thereof
  • Flat bump type non-metal cutting package process and package structure thereof
  • Flat bump type non-metal cutting package process and package structure thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] Such as Figure 1-12 , a planar bump type metal-free cutting packaging process, the steps are as follows:

[0057] 1) Take a metal substrate 1;

[0058] 2) Paste a dry film layer 2 on the front and back of the metal substrate 1 to protect the subsequent etching process;

[0059] 3) Remove part of the dry film layer 2 on the front of the metal substrate 1, and prepare to form the base island 6, ribs, and pins 5 on the metal substrate 1;

[0060] 4) The front metal layer 3 is plated on the front side of the base island 6, connecting ribs, and pin 5 areas prepared to be formed on the metal substrate 1, and the front metal layer 3 of the base island 6 and pin 5 is made of gold, silver, copper, and nickel or nickel palladium metal. In order to facilitate the close combination of the metal wire and the chip area and the pins in the wire bonding during the subsequent wire bonding, the silver plating on the ribs is used for subsequent electroplating and tin plating of the co...

Embodiment 2

[0074] A planar bump-type metal-free cutting package structure, including a chip carrier base, a wire-bonded inner foot carrier base, a chip 7, a metal wire, and a plastic package body 8, and the chip carrier base includes a base island 6 and a metal layer on the front side of the base island 3. The carrying base of the wiring inner foot includes the pin 5 and the front metal layer 3 of the pin, the metal layer 3 is on the connecting rib, and the chip 7 is implanted on the front metal layer 3 of the chip carrying base, and the front side of the chip 7 and the The front metal layer 3 of the pin 5 is respectively connected with both ends of the metal wire to form a semi-finished package structure. The front side and the outer peripheral edge of the package structure semi-finished product are encapsulated with a plastic package 8, and the back of the base island 6 and the pin 5 protrude from the plastic package. 8, the base island 6 protruding from the plastic package body 8, and ...

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PUM

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Abstract

The invention discloses a flat bump type non-metal cutting package process and a package structure thereof, and belongs to the field of semiconductor manufacturing. The flat bump type non-metal cutting package process comprises the following steps: (1) taking a metal substrate; (2) sticking dry film layers on the front surface and the back surface of the metal substrate respectively; (3) removing part of the dry film layer; (4) plating the front surface of a base bump, connection rib and pin region formed on the metal substrate with a front surface metal layer, and plating connection ribs with silver; (5) removing the dry film layers to expose etching regions; (6) performing half etching to form sunken half-etched regions on the metal substrate, and forming base bumps and pins; (7) embedding chips; (8) performing wiring; (9) performing package and post-curing; (10) sticking the dry film layers again; (11) removing the dry film layers from the metal substrate; (12) performing full etching on the region, which is not covered by dry film, on the back surface of the metal substrate to enable the base bumps and the pins to be protruded out of the surface of a plastic package body; (13) removing the dry film layers; (14) forming pin metal layers; (15) performing cutting. The flat bump type non-metal cutting package process achieves the advantages of high reliability and low tool wear.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, more specifically, to a planar bump type metal-free cutting packaging process and its packaging structure. Background technique [0002] For decades, integrated circuit packaging technology has been following the development of integrated circuits, and people have been looking for the best balance between small size and high performance. From the DIP plug-in package in the 1970s to the SOP surface mount package, and then to the QFP flat chip package in the 1980s, the package volume of the chip has been developing towards miniaturization, and the structural performance has been continuously improved. In the 1990s, the QFN four-sided flat package appeared, based on the QFP, the output pins around the package body were retracted to the bottom of the package body, thereby greatly reducing the occupied space during the placement operation. However, QFN often has problems such as unstable in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/78H01L21/50H01L21/56H01L21/60H01L23/48H01L23/31
CPCH01L24/27H01L24/30H01L24/43H01L24/46H01L21/50H01L21/56H01L21/78H01L23/3107H01L23/48H01L2224/301H01L2224/46H01L2224/92247H01L2924/181H01L2224/48091H01L2224/48465H01L2924/00014H01L2924/00012
Inventor 吴奇斌吕磊吴莹莹吴涛邱冬冬李邦杰
Owner CHANGJIANG ELECTRONICS TECH CHUZHOU
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