Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Ceramic micro-needle crystal plate and preparation method thereof

A ceramic micro- and needle-crystal technology is applied in the field of medical beauty equipment, which can solve the problems of insufficient morphology consistency of mesh silicon micro-needles, insufficient micro-needle strength, unsatisfactory puncture effect, poor biocompatibility, etc., and achieves stable and reliable preparation methods. The effect of high drug absorption efficiency and good processing performance

Active Publication Date: 2016-12-07
北京百纳美迪生物科技有限公司
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Silicon microneedles realized by microelectronics technology have good cost performance, but limited by the strength of silicon materials, the appearance consistency of silicon microneedles and the strength of microneedles are not enough, and they are easy to break during use, and silicon is easy to bind with protein. Adhesion, overreaction, poor biocompatibility
The polymer is less rigid, so the puncture effect is not ideal

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ceramic micro-needle crystal plate and preparation method thereof
  • Ceramic micro-needle crystal plate and preparation method thereof
  • Ceramic micro-needle crystal plate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Prepare ceramic microneedle wafer raw material oxide powder, this powder is made up of the following components by mass percentage:

[0039]

[0040] Prepare ceramic microneedle wafers as follows:

[0041] 1) Prepare a stainless steel mother board, cut the mother board into a rectangle and etch the surface of the mother board to obtain an array of inverted conical needle-shaped depressions, the diameter of the conical bottom surface is 150 μm, and the distance between the centers of the bottom surface is 300 μm;

[0042] 2) mixing the prepared wafer raw materials, and finally coating the raw material mixture on the surface of the motherboard;

[0043] 3) Sintering the raw material mixture at 900°C to obtain a wafer;

[0044] 4) Separate the motherboard and the wafer, and cut the wafer to the required size.

[0045] The thickness of the obtained microneedle wafer is 250 μm, and there are microneedles distributed in an array on the surface. and the spacing between t...

Embodiment 2

[0047] Prepare ceramic microneedle wafer raw material oxide powder, this powder is made up of the following components by mass percentage:

[0048]

[0049] Prepare ceramic microneedle wafers as follows:

[0050]1) Prepare a stainless steel mother board, cut the mother board into a rectangle and etch the surface of the mother board to obtain an array of inverted conical needle-shaped depressions, the diameter of the conical bottom surface is 120 μm, and the distance between the centers of the bottom surface is 200 μm;

[0051] 2) mixing the prepared wafer raw materials, and finally coating the raw material mixture on the surface of the motherboard;

[0052] 3) Sintering the raw material mixture at 1200°C to obtain a wafer;

[0053] 4) Separate the motherboard and the wafer, and cut the wafer to the required size.

[0054] The thickness of the obtained microneedle wafer is 450 μm, and there are microneedles distributed in an array on the surface. and the spacing between t...

Embodiment 3

[0056] Prepare ceramic microneedle wafer raw material oxide powder, this powder is made up of the following components by mass percentage:

[0057]

[0058] Prepare ceramic microneedle wafers as follows:

[0059] 1) Prepare a stainless steel mother board, cut the mother board into a rectangle and etch the surface of the mother board to obtain an array of inverted conical needle-shaped depressions, the diameter of the conical bottom surface is 120 μm, and the distance between the centers of the bottom surface is 300 μm;

[0060] 2) mixing the prepared wafer raw materials, and finally coating the raw material mixture on the surface of the motherboard;

[0061] 3) Sintering the raw material mixture at 1100°C to obtain a wafer;

[0062] 4) Separate the motherboard and the wafer, and cut the wafer to the required size.

[0063] The thickness of the obtained microneedle wafer is 450 μm, and there are microneedles distributed in an array on the surface. The pitch between the ne...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
heightaaaaaaaaaa
diameteraaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The invention provides a ceramic micro-needle crystal plate. The crystal plate is provided with a surface and a bottom surface; the surface is provided with needle-shaped bulges which are distributed in an array form; the crystal plate is prepared from the following components in percentage by weight: 60 percent to 80 percent of SiO2, 0.05 percent to 5 percent of Al2O3, 0.5 percent to 10 percent of LiO2, 0.1 percent to 5 percent of K2O, 0.1 percent to 5 percent of Na2O and 0.01 percent to 0.5 percent of Ag2O. The invention further provides a preparation method of the ceramic micro-needle crystal plate. The method comprises the following steps: (1) providing a parent plate and machining the parent plate to obtain reversed needle-shaped concave parts which are distributed in the array form; (2) mixing crystal plate raw materials and coating the surface of a wood plate with a raw material mixture; (3) sintering and molding the raw material mixture to obtain the crystal plate; (4) separating the parent plate from the crystal plate and cutting the crystal plate into needed sizes.

Description

technical field [0001] The invention relates to the technical field of medical cosmetic devices, in particular to a ceramic microneedle wafer and a preparation method thereof. Background technique [0002] The stratum corneum is the natural protective layer of human skin. The thickness of the stratum corneum is about 10-40 microns. It is a layer of dead tissue without blood vessels and nerves. The stratum corneum is a controlled release layer for the percutaneous absorption of nutrients. It is used in skin care products or medicines. The active ingredients in the product cannot penetrate the stratum corneum, or only a very small part can penetrate the stratum corneum, which directly affects the effect. [0003] At present, people hope to puncture the stratum corneum, which is the outermost layer of the skin, through microneedles to increase the penetration of drugs, such as pre-smearing on the microneedles before puncture, so that the drugs can enter the skin after puncture....

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/14A61M37/00
CPCB81C99/0085A61M2037/0046A61M2037/0053B81B2201/055C04B35/14A61M37/0015C04B2235/3201C04B2235/3203C04B2235/3217C04B2235/3229C04B2235/3291
Inventor 于大全
Owner 北京百纳美迪生物科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com