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A kind of preparation method of anti-oxidation copper conductor paste

A technology of conductive paste and copper oxide, which is applied in the direction of cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, electrical components, etc., can solve the problems of poor oxidation resistance, achieve low cost, excellent electrical conductivity, The effect of simple process

Active Publication Date: 2018-05-15
南京鑫研新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to its excellent high electrical conductivity and thermal conductivity, copper powder has broad application prospects in modern high-tech industries and national defense materials, and has become the main direction of research on base metal pastes instead of precious metal pastes. The poor oxidation resistance under the environment greatly limits its application. On this basis, it has important theoretical significance and engineering value to carry out anti-oxidation treatment and develop cost-effective conductive paste.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] 20g of organic carrier, 3.2g of glass powder with an average particle size of 0.93μm, and 76.8g of 300nm copper powder were added to a three-roll mill for three-roll grinding, and the uniformly mixed conductive paste was screen-printed on 96% Al 2 o 3 A specific pattern is printed on the substrate, and the process parameters are adjusted so that the thickness of the paste layer is 20 μm. The printed circuit board was placed in a vacuum furnace to evacuate, and nitrogen gas was introduced as a protective atmosphere. The slurry was sintered at 700°C and kept for 5 minutes to obtain a copper conductive circuit. The square resistance was measured to be 1.7mΩ / □. Tin soldering is performed on the conductor, and the solderable surface area of ​​the conductor is 70% of the total area.

Embodiment 2

[0026] 10g of organic carrier, 3.6g of glass powder with an average particle size of 0.93μm, and 86.4g of 300nm copper powder were added to a three-roll mill for three-roll grinding, and the uniformly mixed conductive paste was screen-printed on 96% Al 2 o 3 A specific pattern is printed on the substrate, and the process parameters are adjusted so that the thickness of the paste layer is 20 μm. The printed circuit board was placed in a vacuum furnace to evacuate, and nitrogen was introduced as a protective atmosphere. The slurry was sintered at 700°C and kept for 5 minutes to obtain a copper conductive circuit. The square resistance was 59.2mΩ / □. Tin soldering is performed on the conductor, and the solderable surface area of ​​the conductor is 45% of the total area.

Embodiment 3

[0028] 20g of organic carrier, 4.8g of glass powder with an average particle size of 0.93μm, and 75.2g of 300nm copper powder were added to a three-roll mill for three-roll grinding, and the uniformly mixed conductive paste was screen-printed on 96% Al 2 o 3 A specific pattern is printed on the substrate, and the process parameters are adjusted so that the thickness of the paste layer is 20 μm. The printed circuit board was placed in a vacuum furnace to evacuate, and nitrogen gas was introduced as a protective atmosphere. The slurry was sintered at 700° C. and kept for 5 minutes to obtain a copper conductive circuit. The square resistance was measured to be 2.8 mΩ / □. Tin soldering is performed on the conductor, and the solderable surface area of ​​the conductor is 75% of the total area.

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PUM

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Abstract

The invention discloses a method for preparing anti-oxidation copper conductor paste. The method comprises the following steps: 1) preparing an organic carrier; 2) evenly mixing copper powder with glass powder to obtain a solid phase mixture, and then carrying out three-roller grinding and mixing on the solid phase mixture and the organic carrier by using a three-roller grinding machine; 3) printing paste into a specific pattern on an Al2O3 substrate by using a silk screen printing machine, and adjusting process parameters to change the thickness of the paste layer into 20 microns; and 4) sintering in a tube furnace under nitrogen atmosphere protection. According to the method disclosed by the invention, since the organic carrier is self made, the cost is low and the volatilization performance is good, and anti-oxidation sintering of the copper conductor paste can be realized by the atmosphere protection. A conducting circuit prepared from the copper conductor paste replaces silver conductor paste in a part of environments, the prepared conductor has excellent conductivity, and the technological process is simple, so that the method is a conductor preparation method having a high economic benefit.

Description

technical field [0001] The invention relates to a conductor paste, in particular to a preparation method of an oxidation-resistant copper conductor paste. Background technique [0002] The conductor paste is used to make interconnection wires, conductors, capacitors, inductors, etc. on the substrate through screen printing, firing and other processes, and can prepare circuit units with certain functional requirements. Conductive paste is the basic material for the development of electronic components, and is also the key material for making chip components and printed circuits. The development of electronic paste is an important step in the development of electronic information materials, which is of great significance to the development of my country's electronic information industry. [0003] In the preparation technology of electronic paste, the preparation of conductive phase metal powder is the key. Without excellent metal powder, there will be no excellent electronic p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 张小敏王昆彦单盼盼魏旭萍王新瑶
Owner 南京鑫研新材料科技有限公司