Passive type MEMS flow-induced vibration strengthened heat transfer apparatus and heat transfer method

Abstract

The invention discloses a passive type MEMS flow-induced vibration strengthened heat transfer apparatus and heat transfer method. Through reasonable structural design, a cantilever beam structure fixed on a heat sink can generate a deflection movement far from the heat sink when the temperature of the heat sink increases, and the deflection angle is enlarged along with the increasing of the heat sink temperature. When the deflection angle of the cantilever beam structure is enlarged, an included angle between the length direction and an inflow velocity direction is correspondingly enlarged, so that the vibration of the cantilever beam vibration part is more fierce; therefore, higher disturbance is brought to a flow field close to the cantilever beam, formation of a heat boundary layer is damaged, and strengthened heat transfer is realized finally; the strengthened heat transfer apparatus does not require manual control and external energy input; and instead, the heat dissipation intensity can be adjusted automatically according to the heat sink temperature, so that a new approach is provided to solve a high heat flux problem of modern electronic devices.

Description

Technical field [0001] The invention relates to a passive temperature-controlled MEMS flow-induced vibration enhanced heat transfer device and a working method thereof, which can be widely used in the field of heat dissipation of modern electronic devices. Background technique [0002] Electronic devices have penetrated into every corner of modern life and play a huge role in many technical fields. With the further development of technology, people have higher and higher performance requirements for electronic devices, presenting a development trend of high performance and small size. This development trend makes the thermal design of electronic devices more and more important. The traditional passive heat dissipation technology represented by increasing the heat transfer area has been difficult to improve its heat dissipation performance under the constraints of the miniaturization of modern electronic device packaging sizes. The new generation of passive heat dissipation techno...

AI Technical Summary

Problems solved by technology

The traditional passive heat dissipation technology represented by increasing the heat transfer area has been difficult to improve its heat dissipation performance under the constraints of the miniaturization of the packaging size of modern electronic devices. However, the new generation of passive heat dissipation technologies such as water cooling and phase change have a relatively Complex, difficult to apply to tiny electronic devices

As for active enhanced heat transfer technologies such as synthetic jets and mechanical disturbances, their structures are also relatively complex, and additional energy needs to be consumed during the heat dissipation process.

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