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Transparent circuit board

A transparent circuit board, transparent conductive technology, used in transparent dielectrics, circuit substrate materials, printed circuits, etc.

Inactive Publication Date: 2016-12-07
GUANGZHOU QIHONG ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the defects of the existing circuit board and its manufacturing method, and provide a new type of transparent circuit board and its manufacturing method. The technical problem to be solved is to make it more beautiful, more widely used, The technical problem that the welding is firm and not easy to fall off

Method used

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Comparison scheme
Effect test

Embodiment 1

[0021] Such as figure 1 As shown, the transparent circuit board of the present invention has a transparent conductive substrate 1, the transparent conductive substrate is a conductive transparent substrate with a square resistance of less than 35Ω, a layer of circuit 2 is provided on the transparent conductive substrate 1, and a layer of circuit 2 is provided on the circuit 2. The electrode 3 of the circuit layer is formed by sputtering two metal material layers.

[0022] Wherein, the first metal material layer 301 is one or more alloys of molybdenum and niobium, with a thickness of 5-100 nanometers.

[0023] The second metal material layer 302 is metal copper with a thickness of 10-300 nanometers.

[0024] The third metal material layer 303 is an alloy of nickel and rare earth elements, with a thickness of 30-500 nanometers.

[0025] A 10-20 μm metal transmission signal line is arranged on the transparent substrate, and the metal transmission signal line is fixed on the sam...

Embodiment 2

[0027] Such as figure 1 As shown, the transparent circuit board of the present invention has a transparent conductive substrate 1, the transparent conductive substrate is a conductive transparent substrate with a square resistance of less than 35Ω, a layer of circuit 2 is provided on the transparent conductive substrate 1, and a layer of circuit 2 is provided on the circuit 2. The electrode 3 of the circuit layer is formed by sputtering two metal material layers.

[0028] Wherein, the first metal material layer 301 is molybdenum with a thickness of 5-100 nanometers.

[0029] The second metal material layer 302 is metal copper with a thickness of 10-300 nanometers.

[0030] The third metal material layer 303 is nickel or an alloy of nickel and rare earth elements, with a thickness of 30-500 nanometers.

[0031] A 10-20 μm metal transmission signal line is arranged on the transparent substrate, and the metal transmission signal line is fixed on the same metal material layer as...

Embodiment 3

[0033] Such as figure 1 As shown, the transparent circuit board of the present invention has a transparent conductive substrate 1, the transparent conductive substrate is a conductive transparent substrate with a square resistance of less than 35Ω, a layer of circuit 2 is provided on the transparent conductive substrate 1, and a layer of circuit 2 is provided on the circuit 2. The electrode 3 of the circuit layer is formed by sputtering two metal material layers.

[0034] Wherein, the first metal material layer 301 is one or two alloys of molybdenum and niobium, and the thickness is 5-100 nanometers.

[0035] The second metal material layer 302 is one or more alloys of copper, nickel, titanium and alloys of rare earth elements, with a thickness of 10-300 nanometers.

[0036] A 10-20 μm metal transmission signal line is arranged on the transparent substrate, and the metal transmission signal line is fixed on the same metal material layer as the circuit electrode.

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Abstract

The invention relates to a transparent circuit board. The transparent circuit board is characterized by comprising a transparent conductive substrate, at least one layer of circuit is arranged on the transparent conductive substrate, insulating layers and transparent conductive layers are arranged between the circuit layers, conductive connecting potentials in point connection with two adjacent layers of circuits are etched on each insulating layer, and the transparent conductive substrate is plated with at least two metal material layers through magnetron sputtering to form electrodes of the circuit layers. The transparent circuit board and a manufacturing method thereof at least have the advantages that a traditional printed circuit board with a resin material as a substrate is replaced with the transparent conductive substrate, so that the transparent circuit board can be applied to various fields and is convenient to use and attractive in appearance, and welding spots are firm and not prone to disengagement.

Description

technical field [0001] The invention relates to a transparent circuit board and a manufacturing method thereof, in particular to a conductive glass circuit board and a manufacturing method thereof. Background technique [0002] As people's living standards and quality of life continue to improve, beauty and convenience have increasingly become one of the factors that people consider in choosing handicrafts. Although integrated circuit technology is developing towards digitalization and miniaturization of electronic devices, its substrate is still not very beautiful and convenient. Circuit boards are generally made of organic resin or ceramics as the substrate material, usually green and opaque. Among them, the circuit board based on organic resin will be difficult to withstand the high temperature caused by the vacuum sputtering process, and the coefficient of thermal expansion (Coefficient of Thermal Expansion, CTE) of the resin material is very large, so it is easy to mak...

Claims

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Application Information

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IPC IPC(8): H05K1/03H05K1/09
CPCH05K1/03H05K1/09H05K2201/0108H05K2201/0317H05K2201/0338
Inventor 李天奇
Owner GUANGZHOU QIHONG ELECTRONICS TECH
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