Segment-type microcirculation radiator and microcirculation heat exchange system

Abstract

The invention discloses a segment-type microcirculation radiator and a microcirculation heat exchange system. The segment-type microcirculation radiator comprises a heat source module installation plate, a radiator installation plate and a heat dissipation assembly, wherein the heat source module installation plate and the radiator installation plate are fixed to each other and a main working medium cavity for accommodating a working medium is formed in the heat source module installation plate and the radiator installation plate; the heat dissipation assembly comprises a plurality of radiating fins which are stacked at certain distances, and microcirculation heat dissipation modules; the microcirculation heat dissipation modules are arranged in the corresponding radiating fins in a penetrating manner; each microcirculation heat dissipation module is of a tubular structure of which one end is opened and the other end is closed and a branch working medium cavity is formed in each microcirculation heat dissipation module; each branch working medium cavity communicates with the main working medium cavity; and liquid-absorbing micro-channels with capillary structures are arranged in the inner walls of the main working medium cavity and the branch working medium cavities and capillary channels of the liquid-absorbing micro-channels communicate with each other. The segment-type microcirculation radiator and the microcirculation heat exchange system are compact in structure, high in heat transfer efficiency, lower in noise, lower in auxiliary power consumption, high in reliability and wide in market prospect, and the problem of a main bottleneck in electron component industry development is well solved.

Description

technical field [0001] The invention relates to a radiator, in particular to a tube-fin microcirculation radiator and a microcirculation heat exchange system. Background technique [0002] With the development of science and technology, the miniaturization and high integration of high-power and high-performance electronic component application systems have led to a sharp increase in the calorific value of electronic equipment per unit volume and excessive local temperatures. When electronic components are in a high temperature state for a long time, they often fail due to overheating. In addition, when the use environment has strict restrictions on the volume and weight of the heat exchange system and the heat dissipation requirements are still high, it is difficult for the traditional forced liquid circulation cooling method, forced air cooling method or gravity heat pipe phase change cooling method to meet the requirements of high power, The heat dissipation requirement u...

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem that the traditional radiator proposed above cannot meet the heat dissipation requirements under the condition of high power and high heat flux density, and researches and designs a tube-fin microcirculation radiator and a microcirculation heat exchange system

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