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Segment-type microcirculation radiator and microcirculation heat exchange system

A radiator and fin-type technology, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problem that the radiator cannot meet the heat dissipation requirements, and achieve auxiliary power saving, convenient installation, The effect of increasing the secondary heat exchange area

Active Publication Date: 2016-12-21
CRRC DALIAN INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem that the traditional radiator proposed above cannot meet the heat dissipation requirements under the condition of high power and high heat flux density, and researches and designs a tube-fin microcirculation radiator and a microcirculation heat exchange system

Method used

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  • Segment-type microcirculation radiator and microcirculation heat exchange system

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Embodiment Construction

[0040] Such as Figure 1 to Figure 3 As shown, a tube-fin microcirculation radiator includes a heat source module mounting plate 4 for installing a heat source module 3, a radiator mounting plate 5 and a heat dissipation assembly, and the heat source module mounting plate 4 and the radiator mounting plate 5 are fixed to each other And the main working medium cavity 7 for accommodating the working medium 8 is formed inside. The heat dissipation assembly includes a plurality of heat dissipation fins 12 stacked at a certain distance and a microcirculation heat dissipation module 9 penetrating in the heat dissipation fins 12. The microcirculation heat dissipation module 9 is a tubular structure with one end open and one end closed. The inside of the microcirculation dispersion module 9 is a division cavity 11. The radiator mounting plate 5 is provided with an installation port. The opening end of the microcirculation dispersion module 9 Installed at the installation opening on the...

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Abstract

The invention discloses a segment-type microcirculation radiator and a microcirculation heat exchange system. The segment-type microcirculation radiator comprises a heat source module installation plate, a radiator installation plate and a heat dissipation assembly, wherein the heat source module installation plate and the radiator installation plate are fixed to each other and a main working medium cavity for accommodating a working medium is formed in the heat source module installation plate and the radiator installation plate; the heat dissipation assembly comprises a plurality of radiating fins which are stacked at certain distances, and microcirculation heat dissipation modules; the microcirculation heat dissipation modules are arranged in the corresponding radiating fins in a penetrating manner; each microcirculation heat dissipation module is of a tubular structure of which one end is opened and the other end is closed and a branch working medium cavity is formed in each microcirculation heat dissipation module; each branch working medium cavity communicates with the main working medium cavity; and liquid-absorbing micro-channels with capillary structures are arranged in the inner walls of the main working medium cavity and the branch working medium cavities and capillary channels of the liquid-absorbing micro-channels communicate with each other. The segment-type microcirculation radiator and the microcirculation heat exchange system are compact in structure, high in heat transfer efficiency, lower in noise, lower in auxiliary power consumption, high in reliability and wide in market prospect, and the problem of a main bottleneck in electron component industry development is well solved.

Description

technical field [0001] The invention relates to a radiator, in particular to a tube-fin microcirculation radiator and a microcirculation heat exchange system. Background technique [0002] With the development of science and technology, the miniaturization and high integration of high-power and high-performance electronic component application systems have led to a sharp increase in the calorific value of electronic equipment per unit volume and excessive local temperatures. When electronic components are in a high temperature state for a long time, they often fail due to overheating. In addition, when the use environment has strict restrictions on the volume and weight of the heat exchange system and the heat dissipation requirements are still high, it is difficult for the traditional forced liquid circulation cooling method, forced air cooling method or gravity heat pipe phase change cooling method to meet the requirements of high power, The heat dissipation requirement u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20336
Inventor 刘俊杰陈广泰王硕高世驹宗庆贺
Owner CRRC DALIAN INST CO LTD
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