Resin binder concrete grinding and polishing wafer and preparing method thereof
A bonding agent and concrete technology, used in grinding/polishing equipment, abrasives, grinding devices, etc., can solve problems such as inability to apply dry grinding requirements, heavy-duty grinders cannot meet grinding requirements under heavy load, and achieve good sharpness, The effect of good heat resistance and high economic efficiency
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Embodiment 1
[0024] A resin-bonded concrete grinding tablet. The raw materials of the grinding tablet are composed of 45 parts of diamond, 40 parts of bonding agent, 35 parts of filler and 10 parts of SiC in parts by weight.
[0025] The filler is formed by mixing white corundum fine powder, Cu powder and Vi powder in a mass ratio of 1:1:1.
[0026] The raw material composition of the binder is calculated in parts by weight: 40 parts of DIALOK 939P resin, 8 parts of Cu powder, 6 parts of MgO, 6 parts of ZnO, CaSO 4 3 parts, SiC 7 parts, polytetrafluoroethylene 0.5 parts, furfural resin 0.5 parts and zinc stearate 1 part.
Embodiment 2
[0028] A resin-bonded concrete grinding tablet. The raw materials of the grinding tablet are composed of 55 parts of diamond, 50 parts of bonding agent, 45 parts of filler and 20 parts of SiC in parts by weight.
[0029] The fillers are ZnO, CeO 2 , Cu powder and Vi powder are mixed according to the mass ratio of 1:1:1:1.
[0030] The raw material composition of the binder is calculated in parts by weight: 60 parts of DIALOK 939P resin, 10 parts of Cu powder, 8 parts of MgO, 8 parts of ZnO, CaSO 4 5 parts, SiC 9 parts, polytetrafluoroethylene 1.5 parts, furfural resin 1.5 parts and zinc stearate 2 parts.
Embodiment 3
[0032] A resin-bonded concrete grinding tablet. The raw materials of the grinding tablet are composed of 50 parts of diamond, 45 parts of bonding agent, 40 parts of filler and 15 parts of SiC in parts by weight.
[0033] The filler is Fe 2 o 3 , CeO 2 , Cu powder and Vi powder are mixed according to the mass ratio of 1:1:1:1.
[0034] The raw material composition of the binder is calculated in parts by weight: 50 parts of DIALOK 939P resin, 9 parts of Cu powder, 7 parts of MgO, 7 parts of ZnO, CaSO 4 4 parts, SiC 8 parts, polytetrafluoroethylene 1 part, furfural resin 1 part and zinc stearate 1.5 parts.
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