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Fixed abrasive and grinding technique for sapphire

A technology of fixed abrasive and grinding process, applied in grinding tools, other chemical processes, chemical instruments and methods, etc., can solve the problems of wafer surface scratches, affecting work efficiency, high diamond cost, etc., and achieves fine grinding steps, Grinding flat surface stabilizes the effect of increasing connectivity

Inactive Publication Date: 2017-02-01
TDG YINXIA NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The surface of sapphire needs to be ground during processing. In recent years, the grinding technology of fixed abrasives, which is more efficient, more economical and higher quality than liquid grinding, has also been gradually improved. Among the existing fixed abrasives, most of them are diamonds. Abrasives, however, the Mohs hardness 10 of diamond is much greater than the Mohs hardness of sapphire 9. During the grinding process, it is easy to cause scratches on the surface of the wafer, and the cost of diamond is high, and when silicon dioxide is used as an abrasive for grinding, due to the The hardness of silicon is low and time-consuming and labor-intensive, affecting work efficiency

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A kind of consolidated abrasive for sapphire, the proportioning of described consolidated abrasive for sapphire is as follows: by weight, 55 parts of boron carbide powder of W14, 25 parts of silicon dioxide powder of W50, chrome-plated oxidation of W28 18 parts of aluminum powder, 5 parts of W28 copper powder.

[0024] The boron carbide powder of W14, the silica powder of W50, the chrome-plated alumina powder of W28 and the copper powder of W28 are mixed uniformly after drying respectively, and the consolidated abrasive for sapphire is prepared by mixing uniformly W14 boron carbide powder, W50 silica powder, W28 chrome-plated alumina powder and W28 copper powder are sintered and solidified at 1700°C with curing agent.

[0025] A kind of grinding technique for the solidified abrasive material of sapphire, comprises the steps:

[0026] S1. Prepare a grinding pad, make a grinding pad from the fired consolidated abrasive, and open a reserved slot on one side of the grindin...

Embodiment 2

[0035] A kind of consolidated abrasive for sapphire, the proportioning of described consolidated abrasive for sapphire is as follows: by weight, 57.5 parts of boron carbide powder of W14, 26.5 parts of silicon dioxide powder of W50, chrome-plated oxidation of W28 19 parts of aluminum powder, 6.5 parts of W28 copper powder.

[0036] The boron carbide powder of W14, the silica powder of W50, the chrome-plated alumina powder of W28 and the copper powder of W28 are mixed uniformly after drying respectively, and the consolidated abrasive for sapphire is prepared by mixing uniformly W14 boron carbide powder, W50 silica powder, W28 chrome-plated alumina powder and W28 copper powder are sintered and solidified at 1850°C with curing agent.

[0037] A kind of grinding technique for the solidified abrasive material of sapphire, comprises the steps:

[0038] S1. Prepare a grinding pad, make a grinding pad from the fired consolidated abrasive, and open a reserved slot on one side of the g...

Embodiment 3

[0047]A kind of fixed abrasive for sapphire, the described proportioning of the fixed abrasive for sapphire is as follows: by weight, 60 parts of boron carbide powder of W14, 28 parts of silicon dioxide powder of W50, chrome-plated oxidation of W28 20 parts of aluminum powder, 8 parts of W28 copper powder.

[0048] The boron carbide powder of W14, the silica powder of W50, the chrome-plated alumina powder of W28 and the copper powder of W28 are mixed uniformly after drying respectively, and the consolidated abrasive for sapphire is prepared by mixing uniformly W14 boron carbide powder, W50 silica powder, W28 chrome-plated alumina powder and W28 copper powder are sintered and solidified at 2100°C with curing agent.

[0049] A kind of grinding technique for the solidified abrasive material of sapphire, comprises the steps:

[0050] S1. Prepare a grinding pad, make a grinding pad from the fired consolidated abrasive, and open a reserved slot on one side of the grinding pad;

[...

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PUM

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Abstract

The invention discloses a fixed abrasive and grinding technique for sapphire. The fixed abrasive for sapphire comprises, by mass, 55-60 parts of W14 boron carbide powder particles, 25-28 parts of W50 silicon dioxide powder particles, 18-20 parts of W28 chromeplated aluminum oxide powder particles, and 5-8 parts of W28 copper powder particles. According to the fixed abrasive for sapphire, boron carbide serves as a primary component of a grinding pad, grinding damage caused by diamond with high hardness is avoided, and meanwhile the grinding efficiency is not reduced; and besides, according to the design, the W28 copper powder particles with low hardness and the W50 silicon dioxide powder particles with low hardness are reasonably matched with the W14 boron carbide powder particles for grinding, so that grinding is achieved, the connectivity of a curing agent is improved, the cleaning effect can be achieved when the boron carbide particles fall off, the falling particles are pushed into an arranged reserved notch, and no scratch is left on sapphire.

Description

technical field [0001] The invention belongs to the technical field of sapphire processing, and more specifically relates to a consolidated abrasive for sapphire. Simultaneously, the invention also relates to a grinding process for the solid abrasive of sapphire. Background technique [0002] Sapphire has the characteristics of high hardness, good light transmission, good wear resistance, good chemical stability, thermal conductivity, electromagnetic insulation, and excellent mechanical properties. It is widely used in many fields such as industry, national defense, and scientific research. In the LED industry, due to the characteristics of sapphire, sapphire is widely used as the best substrate. [0003] The surface of sapphire needs to be ground during processing. In recent years, the grinding technology of fixed abrasives, which is more efficient, more economical and higher quality than liquid grinding, has also been gradually improved. Among the existing fixed abrasives...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/24B24B1/00C09K3/14
Inventor 张吉康森滕斌倪浩然徐金鑫唐彩莉
Owner TDG YINXIA NEW MATERIAL CO LTD