Heat treatment equipment process control device and heat treatment equipment process control method with multiple main process steps

Abstract

The invention provides a heat treatment equipment process control device and a heat treatment equipment process control method with multiple main process steps. The heat treatment process control device comprises the components of a heater, an electric power supply unit which supplies electric power to the heater, a temperature measuring unit which measures temperature of a reacting chamber, a signal processing unit, a power control unit which is included in the electric power supply unit, a specialized temperature controller and a process module controller. The heat treatment equipment process control method comprises the steps of before the process is started, introducing process parameters of at least two main process steps in a process file and process parameter information of all auxiliary process files which correspond with the main process steps into a buffer area of the temperature controller by the process module controller; and in main process step switching, actively transmitting a switching controlling semaphore by the process module controller, introducing a to-be-updated process parameter from the buffer area into the operating power control unit by the specialized temperature controller in a pointer manner or memory position jumping manner, and realizing control information updating of the electric power supply unit together with the signal processing unit.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing applications, in particular to a heat treatment equipment process control device and method with multi-level main process steps, that is, a data communication and scheduling method for the heat treatment equipment process control system. Background technique [0002] With the continuous improvement of semiconductor manufacturing technology, the integration level of integrated circuits is getting higher and higher, and the size of chips is getting smaller and smaller. As a result, the complexity of the semiconductor manufacturing process is getting higher and higher. For example, the reduction of critical dimensions makes the photolithography process more demanding, and the same is true for the heat treatment processes required in processes such as oxidation, deposition, diffusion, and annealing in the semiconductor chip manufacturing process. [0003] The heat treatment p...

AI Technical Summary

Problems solved by technology

[0006] Current heat treatment equipment usually needs to be configured with a temperature controller that can be set separately. However, conventional commercial PID temperature controllers can only set and input single-step control parameter information. Every time the process controller sends process file information, it will communicate with the temperature controller. Perform signal handshake, data transmission, data return, verification check, confirmation signal and other operations between them, or cause delays in process switching operations (tens to hundreds of milliseconds)

This will cause uncontrollable factors in the repeatability of each group of process time, and the accumulation of several seconds of process time deviation will cause the deviation of process quality to exceed the control range

[0007] At the same time, although temperature controllers using advanced control algorithms have been applied, the way of single-step control parameter data setting makes it difficult to guarantee the real-time and stability of data interaction between the process control system and temperature controllers

Images