Preparation technique of high-purity nickel ingot for semiconductor target

Abstract

The invention provides a preparation technique of a high-purity nickel ingot low in impurity element content, namely a preparation technique of a high-purity nickel ingot for a semiconductor target. The preparation technique comprises the main steps that material preparation, charging and repeated smelting are conducted, specifically, an electron beam furnace is used for smelting, warming smelting starts to be conducted when the vacuum degree of a hearth is maintained to 1.0*10<2> Pa or below in the smelting process, the smelting temperature is controlled to 2130 DEG C or over, the smelting speed is controlled to 20.1 kg / h or below, and an electrolysis nickel board is fully molten; and the nickel ingot formed after smelting is cooled in the hearth for 6-12 h and then discharged out of the furnace. According to the preparation technique of the high-purity nickel ingot for the semiconductor target, parameters including the smelting speed, the smelting temperature, the smelting time and the like are selected according to the quantity of materials, electron beams are controlled to be distributed accurately in the smelting process, and thus the purity of metal and volatilizing removal of impurities can be controlled to the maximum extent; and high-purity metallic nickel is free of pores and inclusions and suitable for subsequent processing and using of the target.

Description

technical field [0001] The invention belongs to metal material smelting technology, relates to the preparation of nickel ingots, in particular to a preparation process of high-purity nickel ingots for semiconductor targets. technical field [0002] The invention belongs to metal material smelting technology, relates to the preparation of nickel ingots, in particular to a preparation process of high-purity nickel ingots for semiconductor targets. Background technique [0003] Nowadays, people have higher and higher requirements for the performance of electronic products, especially for the performance of display devices of electronic products, such as clear display, high sensitivity, reliable quality, small size, long-term use of equipment No fever etc. Especially to meet the requirements of clear display, it is inseparable from the development and application of high-performance target materials. Therefore, high-performance display devices are more dependent on high-pe...

AI Technical Summary

Problems solved by technology

At present, the material is dependent on imports, and its preparation process is ominous