Unlock instant, AI-driven research and patent intelligence for your innovation.

Adhesive-free flexible printed circuit board substrate and preparation method

A soft board substrate and base material technology, which is applied in the manufacture of printed circuits, the improvement of metal adhesion of insulating substrates, and the secondary treatment of printed circuits. It can solve the problems of poor dimensional stability, poor heat resistance and dimensional stability of adhesives, Poor heat resistance and other problems, to achieve the effects of good machining performance, adjustable metal layer thickness, and excellent bending performance

Inactive Publication Date: 2017-02-15
南通安洲制冷设备有限公司
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

3L-FCCL is mainly composed of three layers of insulating base film, adhesive, and copper foil. However, the heat resistance and dimensional stability of the adhesive are poor. The field of board substrates is extremely limited
The manufacturing methods of the second type of flexible substrates are different, the material properties are also different, and the applied product items are different. 3L-FCCL is used in the current bulk of flexible board products, while 2L-FCCL is used in higher-level flexible board manufacturing. , such as soft and hard board, COF, etc., and the price of 2L-FCCL is relatively expensive, the output is low, and there are also problems of slow output speed and low quality
Traditional circuit substrates are mostly adhesive materials, which are made by composite pressing of polymer adhesive materials and copper plates. This material has great disadvantages: 1) The peel strength between metal and base material is low, and at the same time, due to the existence of adhesive materials Poor heat resistance; 2) poor dimensional stability; 3) poor adjustability of metal thickness, unable to achieve ultra-thin metal layer
4) The use of chemical materials makes it difficult to solve environmental problems
[0007] The comprehensive performance of the non-adhesive soft board base material prepared by the above method is better than that of the adhesive base material, which is the main development trend of the current base material. The thickness uniformity of the metal material layer of the board substrate is poor, the metal material layer is thick, and the thickness of the metal material layer cannot be adjusted during the preparation process, and the ultra-thin metal layer cannot be achieved. The composite strength of the metal material layer and the PI base film is weak, and the bending performance is poor. Poor, poor machining performance and other defects, the reliability of the base material is poor during use, which seriously affects the subsequent use performance of the base material

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Adhesive-free flexible printed circuit board substrate and preparation method
  • Adhesive-free flexible printed circuit board substrate and preparation method

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0049] The preparation method of the non-adhesive soft board base material is as follows:

[0050] 1. Corona treatment.

[0051] According to the characteristics of PI, the polyimide (PI) film with a thickness of 3-50μm and a width of 20-1200mm is fed into the corona machine under the condition of air cleanliness of 10,000 grades and in an environment to eliminate static electricity. Surface corona treatment is carried out on the surface of the film to improve the adhesion performance of the surface of the substrate material PI film. During the corona treatment process, the control voltage is 5000-20000V, and the corona voltage and current are adjusted until the surface energy of the PI film reaches 50. -55 dyne.

[0052] Wherein, the corona treatment described in the present invention is conventional surface corona treatment.

[0053] 2. Physical vapor deposition treatment

[0054] Send the corona-treated base material PI film into the magnetron sputtering equipment, contr...

Embodiment 1

[0065] Example 1 Preparation method of non-adhesive soft board substrate with double-sided metal layer

[0066] 1. Corona treatment

[0067] According to the characteristics of PI, the polyimide (PI) film base material with a thickness of 50 μm and a width of 1200 mm is fed into the corona machine under the condition of air cleanliness of 10,000 grades and in an environment to eliminate static electricity. Surface corona treatment is carried out on both sides (that is, the upper and lower sides) to improve the adhesion performance of the surface of the PI film of the base material. In the process of corona treatment, the control voltage is 20000V, and the corona voltage and current are adjusted to reach the surface energy of the PI film. Reach 50 dyne.

[0068] Wherein, the corona treatment described in the present invention is conventional surface corona treatment.

[0069] 2. Physical vapor deposition treatment

[0070] The substrate material PI film treated by surface co...

Embodiment 2

[0081] Example 2 Preparation method of non-adhesive soft board substrate with single-sided metal layer

[0082] 1. Corona treatment

[0083] According to the characteristics of PI, under the condition of air cleanliness of 10,000, and in the environment of eliminating static electricity, the polyimide (PI) film base material with a thickness of 3 μm and a width of 30 mm is sent into the corona machine, and the PI film Surface corona treatment is carried out on one side (that is, the upper surface) to improve the adhesion performance of the surface of the PI film of the base material. Reach 55 dyne.

[0084] Wherein, the corona treatment described in the present invention is conventional surface corona treatment.

[0085] 2. Physical vapor deposition treatment

[0086] Send the corona-treated base material PI film into the magnetron sputtering equipment. The temperature is controlled below 100°C, and the copper film is deposited by sputtering on the PI film of the base mate...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a functional adhesive-free flexible printed circuit board substrate. The functional adhesive-free flexible printed circuit board substrate is composed of a metal layer, a base layer and a metal passivation layer which are superimposed to one another. The preparation method of the flexible printed circuit board substrate includes the following steps that: (1) polyimide is used to make a basal body, and surface treatment is performed on two surfaces (or one surface) of the basal body; (2) a physical vapor deposition (PVD) method is adopted to form a metal film layer on the PI face of a treated surface through deposition; and (3) passivation treatment is performed on the metal film layer. The adhesive-free flexible printed circuit board substrate has high-strength tensile performance, excellent chemical resistance, heat resistance, dimensional stability, peel strength, compactness, uniform consistency, and mechanical machining performance, is strong in shielding function, and can be used for manufacturing printed circuit boards (PCB), flexible printed circuits (FPC), rigid-flex boards, special function (shielding function) materials and the like. The PVD method is adopted to deposit the metal layer, so that the thickness of the metal layer is can be adjusted, and therefore, achievement of superfine precision circuits can be possible. The flexible printed circuit board substrate is low in cost, environment-friendly, good in bending performance and easy for technical processing.

Description

technical field [0001] The invention relates to a soft board base material and a preparation method thereof, in particular to an adhesive-free soft board base material and a preparation method thereof. Background technique [0002] "Without electronic substrates, there would be no electronic technology industry today." Benefiting from the rapid development of electronic information and other industries, the market demand for electronic substrates is becoming stronger and stronger. Flexible Printed Circuit (FPC), referred to as FPC, has the advantages of softness, lightness, thinness, and flexibility. It has been widely used under the trend of information electronics products becoming light, thin, short, and small. Used in notebook computers, digital related, mobile phones, LCD monitors, etc. At present, the world's electronic substrates use adhesive substrates and non-adhesive substrates. [0003] Traditional adhesive flex substrates are divided into two categories: th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/14H05K3/38
CPCH05K3/146H05K3/381
Inventor 刘尧平
Owner 南通安洲制冷设备有限公司