OLED substrate and manufacturing method thereof

Abstract

The invention provides an OLED substrate and a manufacturing method thereof. The manufacturing method of the OLED substrate of the present invention can reduce the risk of mis-stripping of the pixel definition layer in the photoresist stripping process by using inorganic materials to make the pixel definition layer, and at the same time reduce the risk of contamination of the fine metal mask in the evaporation process , Improve the use efficiency of the fine metal mask. The OLED substrate of the present invention is prepared by adopting the manufacturing method of the above-mentioned OLED substrate, the structure of the pixel definition layer is complete, the lower anode and the substrate substrate can be effectively protected, and the performance of the device is good.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an OLED substrate and a manufacturing method thereof. Background technique [0002] Organic Light-Emitting Diode (OLED) display, also known as organic electroluminescent display, is an emerging flat panel display device, due to its self-illumination, low driving voltage, high luminous efficiency, short response time, It has many advantages such as high definition and contrast, nearly 180° viewing angle, wide operating temperature range, flexible display and large-area full-color display. It is recognized by the industry as the display device with the most development potential. [0003] According to the driving method, OLEDs can be divided into two categories: passive matrix OLED (Passive Matrix OLED, PMOLED) and active matrix OLED (Active Matrix OLED, AMOLED). Among them, AMOLED has pixels arranged in an array, belongs to the active display type, has high luminous efficiency, ...

AI Technical Summary

Problems solved by technology

Since the pixel definition layer 300 is usually made of a photoresist material, that is, the same material as the photoresist layer 800, it is easy to cause false peeling of the pixel definition layer 300 during the peeling process of the photoresist layer 800. so that after the following structural layers such as the hole injection layer 410, the hole transport layer 420, the organic light-emitting layer 430, the electron transport layer 440, the electron injection layer 450, and the cathode 460 are formed, the protection of the pixel definition layer 300 will be lost. Several anodes 200 are short-circuited, causing the OLED device to fail

[0007] At the same time, if image 3 As shown, in the OLED manufacturing process, the evaporation process of the structural layers such as the hole injection layer 410, the hole transport layer 420, the organic light-emitting layer 430, the electron transport layer 440, the electron injection layer 450, and the cathode 460 needs to use Fine Metal Mask (FMM, Fine Metal Mask) 900, since the photoresist material used in the pixel definition layer 300 is not stable, it is very easy to volatilize onto the fine metal mask 900 during the evaporation process, Contamination of the fine metal mask 900 is caused, the cleaning frequency of the fine metal mask 900 is increased, and the use efficiency is reduced, thereby increasing the production cost

Images