A process method and equipment system for melting film of organic silicon resin light conversion body based on LED packaging

Abstract

The invention relates to an organic silicon resin light transformation body membrane fusion technological method based on LED packaging, and an equipment system. The method and system are characterized in that the method comprises the steps: carrying out the rolling molding for the refining of a light transformation membrane, carrying out the heating rolling forming of the refined light transformation membrane, and carrying out the fusion of the refined light transformation membrane after rolling forming; the system comprises a glaze surface rolling stitching device for refining the light transformation membrane, a rolling forming device for the heating rolling forming of the refined light transformation membrane, and a membrane fusion device for the fusion of the refined light transformation membrane after rolling forming; the glaze surface rolling stitching device, the rolling forming device and the membrane fusion device are arranged sequentially, and form cooperative linked operation equipment. The method has the remarkable advantage of replacing a membrane peeling technology with the organic silicon resin light transformation body membrane fusion technology, can meet the demands of the attaching of an organic silicon resin light transformation body to an LED, and improves the production efficiency of industrial batch LED packaging and yield.

Description

technical field [0001] The invention belongs to the technical field of light conversion body packaging LED, and in particular relates to a process method and equipment system for melting film of organic silicon resin light conversion body based on LED packaging. Background technique [0002] LED has the advantages of high brightness, low heat, long life, environmental protection, renewable utilization, etc., and is called the most promising new generation of green lighting source in the 21st century. At present, although the theoretical life of LEDs can reach more than 100,000 hours, in actual use, due to the constraints of various factors such as chip failure, packaging failure, thermal overstress failure, electrical overstress failure or / and assembly failure, among them Package failure is particularly prominent, which makes LEDs prematurely experience light decay or light failure, which will hinder the progress of LEDs as a new type of energy-saving lighting source. In or...

AI Technical Summary

Problems solved by technology

Although this method improves the uniformity of the coating thickness of the light conversion body through the screen printing process, and improves the uniformity of the phosphor particle distribution, so as to achieve the purpose of improving the yield; but there are still the following obvious deficiencies: one is that the screen printing The light converter of silicone resin is coated on the surface of the LED chip, and then due to the influence of thermal overstress during the baking and curing process, it will still cause local bubbles to form on the coating surface of the light converter coating and the LED chip to form unevenness The second is to fill the sealing mold or the lens cover with silica gel and package the LED chip coated with the light conversion body, and then the overall structure is baked and cured due to the influence of thermal overstress, which will still cause cracks in the sealing mold or lens cover. Partial bubbles on the silicone surface layer will form uneven defects, which will inevitably lead to a decrease in LED light efficiency and directly affect the increase in yield

The purpose of this method is to provide the light converter uniformly arranged around the LED, to prevent damage to obtain the LED covered with the light converter layer and the LED device with the LED covered with the light converter layer; but there are also the following Obvious deficiencies: First, during the curing process of the fluorescent resin composition of the light conversion body, due to the influence of thermal overstress, it will still cause local bubbles to form on the surface layer of the light conversion body to form uneven defects; Glue and bonding LED technology will inevitably be affected by thermal overstress, resulting in a decrease in light efficiency in the use of LEDs, resulting in a lower yield rate; third, the process in the entire packaging process is relatively cumbersome, and the production efficiency of packaging LEDs is not high.

Although the object of the invention of this proposal is to improve the uniformity of color and brightness, ease of manufacture, degree of freedom in design, etc. of the semiconductor light-emitting element to which the phosphor-containing resin layer is attached by the resin sheet laminate, but There are also the following obvious deficiencies: one is that the phosphor resin sheet used is a cured phosphor resin sheet, which will not be able to effectively eliminate possible residual pores, unevenness or other processing defects; the other is that in the bonding process, Pressing the pressure tool from the side of the semiconductor light-emitting element will damage the semiconductor light-emitting element; the third is to use the adhesive bonding process in the phosphor resin layer, which is difficult to remove the residue in the bonded semiconductor light-emitting element. objects, the bonding process is very easy to produce air holes, which will reduce the yield rate, and also reduce the light extraction efficiency of LED components due to the existence of the bonding layer.

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