Single-component thermosetting precoated adhesive and preparation method thereof

Abstract

The invention discloses a single-component thermosetting precoated adhesive and a preparation method thereof. The single-component thermosetting precoated adhesive is at least composed of biphenyl structure-contained epoxy resin, solvent, amino resin curing agent and catalyst. The preparation method of the single-component thermosetting precoated adhesive comprises dissolving the biphenyl structure-contained epoxy resin inside the solvent, and then adding in the amino resin curing agent and the catalyst to obtain the adhesive. The single-component thermosetting precoated adhesive has the advantages of being high in adhesive strength and reliability and good in post-curing heat-resistance and moisture-resistance due to the fact of dissolving the biphenyl structure-contained epoxy resin inside the butanone solvent, taking amino resin as the curing agent and matching with toluene sulphonic acid as the catalyst. When applied to materials such as carbon fiber and composite materials, which are difficult to adhere, the single-component thermosetting precoated adhesive is excellent in adhesion strength and reliability. The single-component thermosetting precoated adhesive is a single-liquid type adhesive, thereby being convenient to operate. Meanwhile, the single-component thermosetting precoated adhesive can obtain high adhesion strength without primer or a polishing process.

Description

technical field [0001] The invention relates to a one-component thermosetting pre-coating adhesive and a preparation method thereof, in particular to a one-component thermosetting pre-coating adhesive suitable for in-mold injection molding of metal, carbon fiber or special composite materials and a preparation method thereof. The mixture has good adhesion to composite materials and metals such as thermosetting carbon fiber, thermoplastic carbon fiber and kevlar. Background technique [0002] About in-mold insert injection molding decoration technology (IMD) has been widely used in electronic products, such as: high-end notebook carbon fiber and plastic lamination, mobile phone shell kaflar or metal shell and plastic lamination. [0003] Several bonding methods commonly used in the current in-mold injection molding are: [0004] 1) First of all, surface treatment, metal surface nano-treatment (NMT) is generally used for in-mold injection molded metal parts, surface grinding ...

AI Technical Summary

Problems solved by technology

[0004] 1) First of all, surface treatment, metal surface nano-treatment (NMT) is generally used for in-mold injection molded metal parts, surface grinding is generally used for composite materials such as carbon fiber, primer is applied, and then directly injected, but the strength of both cannot reach Ideal bonding strength and low efficiency; 2) Among other pre-coated adhesives, general solvent-based isocyanate adhesives have low bonding strength, especially for special composite materials such as carbon fiber, and the isocyanate type The adhesive itself has poor high temperature resistance; 3) general thermoplastic adhesives, under high temperature injection molding, the adhesive is easy to pollute the mold cavity after being melted, and is not resistant to high temperature and has low efficiency

[0005] In short, in the prior art, direct injection molding after surface treatment is not high in strength, and the process is cumbersome and inefficient; using other general pre-coated adhesives, the range of bonding materials is limited, the bonding strength is not high, and the temperature resistance is low. poor performance, poor reliability

[0006] Therefore, at present, there is no good solution for the pre-coating of carbon fiber and special composite material in-mold injection molding in China.