Gene sequencing chip, gene sequencing apparatus and gene sequencing method
A gene sequencing and chip technology, which is applied to biochemical equipment and methods, measuring devices, and microbial measurement/inspection, etc., can solve problems such as high cost and complicated manufacturing process, and achieve simple manufacturing process, simple and convenient gene sequencing, and reduce Effects of Manufacturing Difficulty and Cost
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Embodiment 1
[0041] figure 1 A top view of the gene sequencing chip of Example 1 is shown. figure 2 It is the edge of the gene sequencing chip of embodiment 1 figure 1 A cross-sectional view taken along line A-A'.
[0042] Such as figure 1 As shown, the gene sequencing chip includes a substrate 1, on which an electrode 7 and a signal lead 8 are arranged, one end of the signal lead 8 is connected to the electrode 7, and the other end is connected to a detection chip 10 as a signal sending end, and the detection chip 10 is set On one or both sides of the array composed of sequencing units, the detection chip 10 sends a voltage pulse signal to the electrode 7 through the signal lead 8, and detects whether the signal value sensed by the electrode 7 changes. exist figure 1 Among them, the electrodes 7 and the signal leads 8 are arranged in different layers, and are connected through the via holes 9 on the third insulating layer 4 . The electrodes 7 and the signal leads 8 are made of m...
Embodiment 2
[0058] The difference between the gene sequencing chip of this embodiment and the gene sequencing chip in Example 1 will be mainly described below, and the description of the same parts will be omitted for the sake of brevity, wherein the same reference numerals represent the same components.
[0059] Figure 5 A top view of the gene sequencing chip of Example 2 is shown. Figure 6 It is the edge of the gene sequencing chip of embodiment 2 Figure 5 A cross-sectional view taken along line A-A'.
[0060] Such as Figure 5 As shown, the signal leads 8 and the electrodes 7 are arranged on the same layer. Such as Figure 6 As shown, the electrodes 7 are directly formed on the substrate 1 and connected to the signal leads 8 on the same layer.
[0061] Of course, the arrangement of the first insulating layer 2 and the second insulating layer 3 is not limited to the arrangement in the first embodiment.
[0062] For example, Figure 7 Is according to embodiment 2 a modified emb...
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