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A processing method for brazing microstrip boards using printed solder paste

A processing method and technology of microstrip board, applied in metal processing equipment, welding equipment, manufacturing tools, etc., to achieve the effects of improving efficiency, simple operation, and reducing processing costs

Active Publication Date: 2019-09-10
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to improve the large-area brazing efficiency of microwave circuit components and solve the problem of the penetration rate of the substrate and the microstrip board, the invention provides a processing method for brazing the microstrip board using printed solder paste

Method used

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  • A processing method for brazing microstrip boards using printed solder paste
  • A processing method for brazing microstrip boards using printed solder paste
  • A processing method for brazing microstrip boards using printed solder paste

Examples

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Embodiment 1

[0042] Materials used: 1. Solder paste (alpha LR721H3), 2. Absolute ethanol (CH3CH2OH), 3. Dust-free cloth, 4. Anti-static gloves.

[0043] Equipment and tools: 1. Stainless steel scraper (length 200mm), 2. Stencil (370*470mm), 3. Printing platform, 4. Positioning bottom plate, 5. Stirring rod, 6. Solder paste mixer, 7. Ultrasonic cleaner, 8. Reflow oven (VXS374), 9. Thermometer (DATAPAQ / 9000), 10. X-ray detector (Y.Cougar SMT).

[0044] Preparation:

[0045] Take out the stored solder paste from the refrigerator, check the type and expiration date of the solder paste, and stir it with a solder paste mixer: warm it up at room temperature for more than 2 hours before stirring, and stir for 15 minutes.

[0046] Before printing solder paste, use a non-woven cloth to dip an appropriate amount of absolute ethanol to clean the stencil 1. Squeegee, and place them in categories.

[0047] The specific processing steps of the brazed microstrip plate are as follows:

[0048] (1) Clean...

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Abstract

The invention relates to a machining method for soldering micro-strip boards by using printing solder paste. The machining method comprises the following operation steps: (1) the micro-strip boards and substrates are cleaned; (2) four or more cleaned substrates are respectively placed in positioning grooves of positioning baseplates; (3) net plates are placed on the four or more substrates; and mesh units uniformly distributed on the net plates are respectively corresponding to the four or more substrates; (4) the net plates are uniformly coated with the printing solder paste; and (5) the net plates are taken down; the corresponding micro-strip boards are placed on the uniformly deposited solder paste; and each micro-strip board is corresponding to one substrate to form a welding module. The conventional steps of pressing block fixation, welding, pressing block disassembly, cleaning and detection are performed; reflow soldering is adopted; and the reflow soldering is performed by four temperature phases. The machining method saves such complex operation flows as solid-state soldering lug shearing, size control, oxide layer removal, screw hole protection, solder resisting adhesive tape protection and flux coating, reduces the machining cost, and is high in product soldering rate and suitable for batch production.

Description

technical field [0001] The invention belongs to the technical field of brazing processing of microwave circuit components, and in particular relates to a low-temperature brazing process method for a microstrip plate and a substrate (or shell) in a microwave circuit component. Background technique [0002] As a special welding technology, microstrip brazing is mainly a special process method of heating and remelting microstrip and gold workpieces with low-temperature solid solder, and diffusing each other to form electrical and mechanical hard connections. This welding technology microstrip board has good grounding and heat conduction performance, can increase the power capacity of the microstrip line, especially for microwave signal transmission efficiency, and can also greatly reduce the weight of microwave circuit components. Therefore, this technical solution is internationally recognized. The production and processing of microwave circuit components is very popular, and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/012
Inventor 邹文忠桑飞李承虎周自泉杜运叶宝江李明武程贤飞晁瑛胡芳
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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