Low-Ag Cu-based medium-temperature solder

A technology of copper base and brazing material, which is applied in the direction of welding/cutting medium/material, welding medium, metal processing equipment, etc., can solve the problems of brazing performance not as good as silver solder and high melting temperature, and achieve good oxidation resistance and chemical Stable properties, prevent overheating or overheating effect

Inactive Publication Date: 2017-03-22
ANHUI HUAZHONG WELDING MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Conventional copper-based solders such as BCu89PAg, BCu91PAg, etc., although the price is lower, but the melting temperature is higher, the brazing performance is not as good as silver solder in the welding of copper and copper alloys, copper and Bondi tubes, so it cannot replace BAg25CuZnSn Silver solder

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A low-silver copper-based medium-temperature brazing filler metal, calculated by weight percentage, comprising the following raw materials:

[0026] Ag 1.6%, P 7.0%, Ni 2%, Sn 2%, NaF 2.4%, mixed rare earth elements 1.6%, and the balance is copper. Wherein the weight percentage content of each component in the mixed rare earth is 40% of Nd, 20% of Pr and 40% of La.

[0027] Low-silver copper-based medium-temperature solder has a solidus temperature of about 630°C and a liquidus temperature of about 690°C. It can be drawn into wires with a diameter of Φ0.5mm or more, and has good plasticity; copper and copper alloys, carbon The wettability and fluidity on the steel are good, the wetting angle is 2°~4°, and the tensile strength reaches 560MPa.

Embodiment 2

[0029] A low-silver copper-based medium-temperature brazing filler metal, calculated by weight percentage, comprising the following raw materials:

[0030] Ag 1.2%, P 7.2%, Ni 3%, Sn 3.5%, NaF 3.4%, mixed rare earth elements 2.4%, and the balance is copper. Wherein the weight percentage content of each component in the mixed rare earth is 32% of Nd, 28% of Pr and 40% of La.

[0031] Low-silver copper-based medium-temperature solder has a solidus temperature of about 630°C and a liquidus temperature of about 692°C. It can be drawn into wires with a diameter of Φ0.5mm or more, and has good plasticity; copper and copper alloys, carbon Good wettability and fluidity on steel, the wetting angle is 2°-4°, and the tensile strength reaches 555MPa.

Embodiment 3

[0033] A low-silver copper-based medium-temperature brazing filler metal, calculated by weight percentage, comprising the following raw materials:

[0034] Ag 2.0%, P 6.5%, Ni 1%, Sn 1.5%, NaF 1.4%, mixed rare earth elements 0.8%, and the balance is copper. Wherein the weight percentage content of each component in the mixed rare earth is 40% of Nd, 27% of Pr and 33% of La.

[0035] Low-silver copper-based medium-temperature solder has a solidus temperature of about 645°C and a liquidus temperature of about 700°C. It can be drawn into wires with a diameter of Φ0.5mm or more, and has good plasticity; copper and copper alloys, carbon The wettability and fluidity on the steel are good, the wetting angle is 2°~4°, and the tensile strength reaches 542MPa.

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Abstract

The invention provides low-Ag Cu-based medium-temperature solder. The solder is prepared from raw materials in percentage by weight as follows: 1.2%-2.0% of Ag, 6.5%-7.2% of P, 1%-3% of Ni, 1.5%-4% of Sn, 1.4%-3.6% of NaF, 0.5%-2.4% of mixed rare-earth elements and the balance of Cu; mixed rare-earth comprises components in percentage by weight as follows: 30%-40% of Nd, 20%-30% of Pr and 30%-40% of La. According to the solder, the Ag content is low, the melting temperature of the solder is relatively low, the wettability and the corrosion resistance are good, the surface of a soldered joint is bright and clean, the mechanical strength is high, and the soldering process performance is excellent.

Description

technical field [0001] The invention belongs to the technical field of brazing materials, and in particular relates to a low-silver copper-based medium-temperature brazing material. Background technique [0002] In recent years, the demand for household appliances represented by air conditioners and refrigerators has gradually increased, and the demand for brazing materials for valve fittings and compressor pipelines has also increased. BAg25CuZnSn silver solder is widely used in the welding of copper and copper alloys, copper and Bondi tubes in air-conditioning, refrigeration and other industries, and its various performance indicators have reached a high level. However, the silver solder needs to use about 25% of the precious metal silver. As the price of raw materials is getting higher and higher, manufacturers who are used for brazing in refrigeration, machinery, electromechanical, electrical appliances, instrumentation, valve fittings and other industries have to seek h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30
CPCB23K35/302
Inventor 曹立兵
Owner ANHUI HUAZHONG WELDING MATERIAL CO LTD
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