A heat-conducting asphalt composite material, its preparation method and application

Abstract

The invention discloses a heat conducting asphalt composite as well as a preparing method and an application thereof. The preparing method comprises the following steps: first, dissolving 8-16 parts by mass of a styrene-butadiene-styrene block copolymer in 12-24 parts of an organic solvent so as to obtain a thick solution; then, uniformly mixing 5-500 parts of a nonorganic heat conducting filler with the obtained thick solution, evaporating the solvent, and grinding even so as to obtain a heat conducting filler premix; fully mixing the heat conducting filler premix with 100 parts of matrix asphalt so as to obtain a heat conducting asphalt composite primary material; and finally paving and hot-pressing the heat conducting asphalt composite primary material so as to obtain the heat conducting asphalt composite. According to the heat conducting asphalt composite prepared by the method, the nonorganic heat conducting filler is selectively distributed in SBS phases, the heat conductivity and the thermal performance of the composite are obviously improved, and the heat conducting asphalt composite is particularly suitable for a thermal interface material. The preparing method provided by the invention is simple in technology, low in cost and suitable for massive production.

Description

technical field [0001] The invention belongs to the field of thermal interface materials, and more specifically relates to a heat-conducting asphalt composite material, its preparation method and application. Background technique [0002] With the rapid development of electronic technology, the integration and assembly density of electronic components are constantly increasing. While providing powerful functions, it also leads to a sharp increase in the heat generated during work. Timely and effective heat dissipation has become an urgent problem to be solved. . When the electronic components are in direct contact with the heat sink, due to the microscopic unevenness between the two solid contact surfaces, the actual contact area may only be 1% to 2% of the actual area, and the thermal conductivity of the air in the gap is only 0.025W m -1 ·K -1 , which results in a huge thermal resistance between the interfaces. Filling the thermal interface material with high thermal co...

AI Technical Summary

Problems solved by technology

The inorganic thermally conductive filler forms a network with high thermal conductivity in the SBS phase, and at the same time enhances the thermal properties of the SBS modified asphalt matrix and improves the softening point of the composite material, thereby solving the problem of low thermal conductivity of the filler in the prior art and high cost of the polymer matrix technical issues

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