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Preparation method for detecting explosive sensitive thin-film

A technology for sensitive thin films and explosives, applied in material excitation analysis, fluorescence/phosphorescence, etc., can solve the problems of time-consuming, cumbersome process, and high raw material cost, and achieve the effects of improving preparation efficiency, good repeatability, and fast stability

Inactive Publication Date: 2017-03-22
武汉鹰飞拓光电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Many current polymer film-forming methods are cumbersome, time-consuming, and costly raw materials

Method used

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  • Preparation method for detecting explosive sensitive thin-film
  • Preparation method for detecting explosive sensitive thin-film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] a. Prepare polymer solution: Dissolve fluorescent polymer (such as MEH-PPV, coumarin, PPV derivatives, etc.) in chloroform or toluene at a concentration of 1-1.5mg / ml; b. Pretreatment: silicon wafers are cut into approximately 1 × 1cm-sized silicon wafers; silicon wafers and glass wafers are treated with hydrogen peroxide (H 2 o 2 ) Ultrasonic cleaning for 5 minutes, then ultrasonic cleaning with deionized water for 5 minutes, ultrasonic cleaning with ethanol for 5 minutes, and finally immersing it in ethanol for use; The spray gun blows off the dust and liquid droplets on the surface; the speed of the homogenizer is 400--700r / min, and the speed is kept for 6s; —80um fluorescent film material. d. Apply the obtained film to a small explosive detector (patent number: 20122066387.4), and detect explosives according to the phenomenon of fluorescence quenching.

Embodiment 2

[0018] a. prepare polymer solution: dissolve fluorescent polymer (such as MEH-PPV) in chloroform or toluene, concentration is 1.2mg / ml; b. pretreatment of silicon wafer and glass wafer: silicon wafer is cut into about 1 ×1cm silicon wafer; silicon wafer and glass wafer with hydrogen peroxide (H 2 o 2 ) Ultrasonic cleaning for 5 minutes, then ultrasonic cleaning with deionized water for 5 minutes, ultrasonic cleaning with ethanol for 5 minutes, and finally immersing it in ethanol for use; The spray gun blows off the dust and liquid droplets on the surface; set the glue leveling machine speed 1 to 0r / min and the glue leveling speed 2 to 1000r / min to keep the parameters for 40s. During the glue leveling speed 2, drop 2 The polymer fluorescent material is dropped to obtain a fluorescent thin film material with uniform thickness.

Embodiment 3

[0020] a. prepare polymer solution: dissolve fluorescent polymer (such as MEH-PPV) in chloroform or toluene, concentration is 1.2mg / ml; b. pretreatment of silicon wafer and glass wafer: silicon wafer is cut into about 1 ×1cm silicon wafer; silicon wafer and glass wafer with hydrogen peroxide (H 2 o 2 ) Ultrasonic cleaning for 5 minutes, then ultrasonic cleaning with deionized water for 5 minutes, ultrasonic cleaning with ethanol for 5 minutes, and finally immersing it in ethanol for use; The spray gun blows off the dust and liquid droplets on the surface; set the glue leveling machine speed 1 to 0r / min and the glue leveling speed 2 to 2000r / min to keep the parameters for 40s. During the glue leveling speed 2, drop 2 The polymer fluorescent material is dropped to obtain a fluorescent thin film material with uniform thickness.

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Abstract

The invention discloses a preparation method for detecting an explosive sensitive thin-film. The method comprises the steps of preparing a polymer solution, wherein a fluorescent polymer is dissolved into chloroform or methylbenzene, and the concentration is 1-1.5 mg / ml; preprocessing a silicon wafer and a glass sheet; preparing a polymer fluorescent thin-film through a spinning method. The sensitive thin-film is applied to a small explosive detector; meanwhile, the preparation technology for the sensitive thin-film can be controlled, the fluorescence intensity needed by a detector can be met, the stability and reliability of the thin-film can be improved, and the method has the advantages of being low in cost, rapid and good in repeatability.

Description

technical field [0001] The invention belongs to the technical field of polymer film materials, and in particular relates to a preparation method of a sensitive film for detecting explosives. Background technique [0002] At present, fluorescent sensors for detecting explosives mainly have polymer materials with fluorescent characteristics. When the membrane absorbs the gas to be measured, it will cause changes in the properties of the membrane, causing changes in the fluorescence intensity of sensitive materials, and serve the purpose of detecting explosives. The selectivity and sensitivity of the membrane are determined by many factors, including the physical and chemical properties of the membrane, the nature of the analyte, the choice of the slide and operating conditions, etc. There are many ways to prepare polymer films, and the commonly used methods mainly include self-assembly method, vapor deposition polymerization method, spin coating method, and inkjet method. Man...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/64
Inventor 杨明红白燕
Owner 武汉鹰飞拓光电子股份有限公司
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