Solder, sputtering target material, and manufacturing method of solder
A technology of sputtering target and solder, applied in sputtering plating, welding/cutting medium/material, welding equipment, etc., can solve the problems of high price, poor bonding strength, thermal warpage, etc., and achieve the goal of reducing manufacturing cost. Effect
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[0019] The present invention provides a solder and a sputtering target made of the solder, which can solve the problems of high manufacturing cost, difficulty in large-area application and easy thermal warping of the existing sputtering target. In order to make the above and other objects, features and advantages of the present invention more comprehensible, several sputtering targets made of solder with different composition ratios are given as examples in detail below.
[0020] However, it must be noted that these specific implementation cases and methods are not intended to limit the present invention. The invention can still be practiced with other features, components, methods and parameters. The proposal of the preferred embodiment is only used to illustrate the technical characteristics of the present invention, and is not intended to limit the patent scope of the present invention. Those skilled in the technical field will be able to make equal modifications and chang...
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