Solder, sputtering target material, and manufacturing method of solder

A technology of sputtering target and solder, applied in sputtering plating, welding/cutting medium/material, welding equipment, etc., can solve the problems of high price, poor bonding strength, thermal warpage, etc., and achieve the goal of reducing manufacturing cost. Effect

Inactive Publication Date: 2017-03-29
SUMIKA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high price of indium, and it is easy to cause thermal warpage when it is applied to a large-area target, the target will be easily peeled off from the backplane due to poor bonding strength during high temperature operation.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The present invention provides a solder and a sputtering target made of the solder, which can solve the problems of high manufacturing cost, difficulty in large-area application and easy thermal warping of the existing sputtering target. In order to make the above and other objects, features and advantages of the present invention more comprehensible, several sputtering targets made of solder with different composition ratios are given as examples in detail below.

[0020] However, it must be noted that these specific implementation cases and methods are not intended to limit the present invention. The invention can still be practiced with other features, components, methods and parameters. The proposal of the preferred embodiment is only used to illustrate the technical characteristics of the present invention, and is not intended to limit the patent scope of the present invention. Those skilled in the technical field will be able to make equal modifications and chang...

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Abstract

The invention discloses a solder, a sputtering target material, and a manufacturing method of a solder. The solder is used to bond the target layer to the backing plate to produce a sputtering target. The solder comprises zinc in a weight percent concentration in the range of 8 and 9, tin in a weight percent concentration in the range of 82 and 91.5, and indium in a weight percent concentration in the range of 0.5 to 10, and the sum of tin and indium is less than or equal to the weight percentage of 91. The solder of the present invention can maintain the bonding strength between the target layer and the backing plate under large area and high temperature sputtering conditions.

Description

technical field [0001] The invention relates to a solder for making a sputtering target and a sputtering target using the solder. In particular, it relates to a solder containing indium (In) and a sputtering target using the solder. Background technique [0002] Thin film sputtering technology uses pulsed DC plasma to bombard the surface of the metal target, knocks out the target atoms and sputters and deposits it on the surface of the target substrate to form a thin film. It has the advantages of high quality, good adhesion, and excellent process stability. It can be used in Coating of plastic, metal, glass, cloth or composite materials. [0003] Since the sputtering operation will generate a large amount of heat accumulation on the target, a metal backing plate with better thermal conductivity, such as a copper (Cu) backing plate or a copper alloy backing plate, is used to bond with the target , whereby the heat of the target is dissipated and the target is cooled. If t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26C23C14/34B23K20/00C22C13/00
CPCB23K20/002B23K35/262C22C13/00C23C14/3407
Inventor 杨清河孙璿程吴智稳苏梦鹏翁基祥
Owner SUMIKA TECH
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