Heat conducting glue for water cooling radiator and preparation method thereof

A technology of water-cooled radiators and heat-conducting adhesives, applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problem of high thermal conductivity of heat-conducting adhesives, poor adhesion coefficient of long lengths, copper tubes and aluminum plates falling off, etc. problem, to achieve the effect of high shear strength, fast curing speed and high thermal conductivity

Inactive Publication Date: 2017-04-05
池州脉纬散热器有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing thermal conductive adhesives with high thermal conductivity are not only expensive, but also have poor adhesion coefficient. Over time, it is easy to cause the copper tube and aluminum plate to fall off

Method used

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  • Heat conducting glue for water cooling radiator and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] (1) Pour the hydroxypropyl methacrylate 15, 2-hydroxyethyl methacrylate 15, and tetrahydrofuryl methacrylate 60 into the reaction kettle, mix and stir evenly;

[0020] (2) Pour alumina 340, silicon carbide 85, silicon dioxide 340, and carbon powder 85 into the reaction kettle to mix and stir evenly;

[0021] (3) Grinding the mixture obtained in step (2) to a uniform flowing continuous paste;

[0022] (4) Add benzoyl peroxide 50 to the paste obtained in step (3) and stir evenly;

[0023] (5) The thermally conductive adhesive is obtained after vacuum defoaming, and filled and sealed.

Embodiment 2

[0025] (1) Pour the hydroxypropyl methacrylate 80, 2-hydroxyethyl methacrylate 80, and tetrahydrofuryl methacrylate 300 into the reaction kettle to mix and stir evenly;

[0026] (2) Pour alumina 200, silicon carbide 50, silicon dioxide 200, and carbon powder 20 into the reaction kettle to mix and stir evenly;

[0027] (3) Grinding the mixture obtained in step (2) to a uniform flowing continuous paste;

[0028] (4) Add benzoyl peroxide 10 to the paste obtained in step (3) and stir evenly;

[0029] (5) The thermally conductive adhesive is obtained after vacuum defoaming, and filled and sealed.

Embodiment 3

[0031] The heat sink made by filling the heat conduction adhesive of the present invention with the heat sink made of common heat conduction adhesive is carried out the temperature contrast test,

[0032] The data results are shown in Table 1:

[0033]

[0034] Table 1

[0035] It can be seen from Table 1 that the longer the working time of the electronic components, the more and more heat is emitted by the electronic components. The thermally conductive glue of the present invention can quickly conduct the heat away, and the heat is taken away by the cooling water, while the conventional heat conduction glue in comparison The heat conduction efficiency of the glue is poor, resulting in continuous accumulation of heat, and the temperature of the electronic components continues to rise.

[0036] The heat-conducting adhesive of the present invention belongs to the single-component heat-conducting adhesive, which is more convenient to use than the two-component adhesive, and ...

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PUM

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Abstract

The invention discloses a heat conducting glue for a water cooling radiator. The heat conducting glue is composed of a matrix, a heat conducting filler and a curing agent. The matrix is composed of the following components: 15-80 of hydroxypropyl methacrylate, 15-80 of methacrylic acid-2-hydroxyethyl, and 60-300 of tetrahydrofurfuryl methacrylate. The heat conducting filler is composed of the following components: 200-340 of alumina, 50-85 of silicon carbide, 200-340 of silicon dioxide, and 50-85 of carbon powder. The curing agent is composed of 10-50 of benzoyl peroxide. The heat conducting glue provided by the invention belongs to single-component heat conducting glue, is more convenient for use than two-component glue, has no need for stirring during use, avoids the potential quality hazard caused by uneven stirring, can be applied to polar substrate surfaces, like metals, ceramics and glass, etc., has high shearing strength after curing and fast curing speed, fills the space between a radiator copper pipe and an aluminum block, can firmly fix the copper pipe on the aluminum block, and has high heat conducting efficiency.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a thermally conductive adhesive for water-cooled radiators. Background technique [0002] Due to its own advantages, power electronics technology has been widely used in many fields such as flexible DC (AC) transmission, high-voltage DC transmission and reactive power compensation in power systems, and has great development potential. In power electronic devices, power components will generate a lot of heat during operation, so the heat dissipation problem of power electronic equipment has become more and more prominent, especially in the field of high power, the traditional air-cooled heat dissipation has been unable to meet its basic needs, and has gradually Replaced by water cooling technology. [0003] Existing water-cooled radiators usually use an aluminum plate as the base plate, with built-in casting or embedded copper tubes on the surface, and the cooling water circulates throug...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02C09J4/06C09J11/04
CPCC09J4/00C09J4/06C09J11/04
Inventor 舒双武
Owner 池州脉纬散热器有限责任公司
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