High-toughness bismaleimide resin material and preparation method thereof

A technology of maleimide resin and high toughness, applied in chemical instruments and methods, synthetic resin layered products, lamination devices, etc., can solve the problems of increased viscosity of the resin system and deterioration of the resin system treatment process, and achieve Good interface adhesion, beneficial to material properties, and the effect of improving mechanical properties

Active Publication Date: 2017-04-26
SUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high content of thermoplastic resin (higher than 5wt%), the viscosity of the resin system increases significantly, which makes the processing technology of the resin system worse

Method used

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  • High-toughness bismaleimide resin material and preparation method thereof
  • High-toughness bismaleimide resin material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] (a) Dissolve 0.42g of PBI in 10g of N,N-dimethylacetamide to obtain a PBI solution, divide the PBI solution into 2 equal parts and pour them into 2 horizontal flat molds with the same size, and then Heat at ℃ for 3 hours and at 100℃ for 1 hour to remove the solvent. After natural cooling, peel off the formed PBI film from the flat mold to obtain two PBI films with the same size. The thickness of the film is about 15 μm;

[0023] (b) Under stirring conditions, heat the mixture of 40g bismaleimidodiphenylmethane and 30g allyl bisphenol A at 140°C to a transparent solution, and keep the temperature for about 40min to obtain bismaleimide Aminodiphenylmethane / allyl bisphenol A prepolymer solution, pour it into a preheated flat mold (the length and width of the mold are the same as the length and width of the mold in (a)), vacuumize at 140°C About 30min, then naturally cool to room temperature, take out the prepolymer plate;

[0024] (c) Two pieces of PBI film are tiled resp...

Embodiment 2

[0031](a) Dissolve 1g of PBI in 30g of N,N-dimethylformamide to obtain a PBI solution; divide the PBI solution into three equal parts and pour them into three horizontal flat molds of equal size, respectively, and heat at 60°C for 3h and heated at 100°C for 1 h to remove the solvent, and after natural cooling, the formed PBI film was peeled off from the flat mold to obtain 3 pieces of PBI film with a thickness of 25 μm;

[0032] (b) Under stirring conditions, heat the mixture of 40g bismaleimide diphenyl ether and 40g diallyl bisphenol S at 150°C to a transparent solution, and keep the temperature for about 40min to obtain bismaleimide Imide-based diphenyl ether / diallyl bisphenol S prepolymer solution is poured into two preheated flat molds of the same size (the length and width of the mold are the same as the length and width of the mold in (a) same), vacuumize at 150°C for about 30 minutes, then cool naturally to room temperature, and take out 2 prepolymer plates;

[0033] ...

Embodiment 3

[0040] (a) Dissolve 0.84g of PBI in 20g of N,N-dimethylacetamide to obtain a PBI solution; averagely divide the PBI solution into 4 equal parts and pour them into 4 horizontal flat molds of the same size, respectively, at 60°C Heating for 3 hours and 100°C for 1 hour to remove the solvent, and after natural cooling, peel the formed PBI film from the flat mold to obtain 4 pieces of PBI film with a film thickness of about 10 µm;

[0041] (b) Under stirring conditions, heat 40g of bismaleimidodiphenylmethane and 26g of allylphenol epoxy (bisphenol A diallyl diglycidyl ether) resin mixture to a transparent solution at 140°C , and then keep the temperature for about 40 minutes to obtain the bismaleimidodiphenylmethane / allylphenol epoxy resin prepolymer solution, which is divided into 3 equal parts and poured into 3 preheated flat molds respectively (The length and width of the mold are the same as the length and width of the mold in (a)), vacuumize at 140°C for about 30 minutes, th...

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Abstract

The invention relates to a high-toughness bismaleimide resin system and a preparation method thereof. With bismaleimide, an allyl compound and thermoplastic polybenzimidazole (PBI) as raw materials, a PBI film is prepared, and the PBI film and a bismaleimide / allyl compound resin system prepolymer thin plate are laid in an intersection manner, and the bismaleimide / allyl compound resin system material containing the PBI film is obtained through heat curing treatment. The prepared material can obtain outstanding impact resistance after a small amount of PBI film is inserted, and has the heat resistance and other mechanical properties all higher than or not lower than those of the bismaleimide / allyl compound resin system inserted without the PBI film; the material system has obvious application value in the fields of aviation, aerospace and other high-performance composite materials.

Description

technical field [0001] The invention relates to the field of high-performance resin-based composite materials, in particular to a high-toughness bismaleimide resin material and a preparation method thereof. [0002] technical background [0003] Bismaleimide (BMI) resin is a bifunctional compound with maleimide as the active terminal group. Its cured product has excellent mechanical properties, thermal properties and low dielectric properties, making BMI widely used. in aerospace and other fields. However, BMI resin has high crosslinking density after curing, which makes BMI material have the disadvantages of high brittleness and poor impact resistance, which makes the BMI resin matrix prone to cracks, which seriously affects the application of BMI resin in high-performance composite materials. [0004] The use of allyl compounds to modify BMI is one of the most successful methods in the toughening and modification of BMI resins. The obtained allyl compound modified BMI syst...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/06B32B27/28B32B27/18B32B27/08
CPCB32B27/08B32B27/18B32B27/28B32B37/06B32B2307/558
Inventor 袁莉张权顾嫒娟梁国正
Owner SUZHOU UNIV
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