A kind of high toughness bismaleimide resin material and preparation method thereof

A technology of maleimide resin and bismaleimide, which is applied in the field of high-toughness bismaleimide resin materials and its preparation, can solve the problems of changing BMI resin system molding process and variation, and achieve Conducive to material properties, improve mechanical properties, enhance the effect of mechanical properties

Active Publication Date: 2019-05-28
SUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a high-toughness BMI resin system and a preparation method thereof, which avoids the problem of deterioration of the molding process of the BMI resin system caused by obvious changes in the viscosity of the resin system, and effectively improves the toughness of the resin system at the same time

Method used

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  • A kind of high toughness bismaleimide resin material and preparation method thereof
  • A kind of high toughness bismaleimide resin material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0021] (a) Dissolve 0.42g of PBI in 10g of N,N-dimethylacetamide to obtain a PBI solution, divide the PBI solution into 2 equal parts and pour them into 2 horizontal flat molds with the same size, and then Heat at ℃ for 3 hours and at 100℃ for 1 hour to remove the solvent. After natural cooling, peel off the formed PBI film from the flat mold to obtain two PBI films with the same size. The thickness of the film is about 15 μm;

[0022] (b) Under stirring conditions, heat the mixture of 40g bismaleimidodiphenylmethane and 30g allyl bisphenol A at 140°C to a transparent solution, and keep the temperature for about 40min to obtain bismaleimide Aminodiphenylmethane / allyl bisphenol A prepolymer solution, pour it into a preheated flat mold (the length and width of the mold are the same as the length and width of the mold in (a)), vacuumize at 140°C About 30min, then naturally cool to room temperature, take out the prepolymer plate;

[0023] (c) Two pieces of PBI film are tiled resp...

Embodiment 2

[0030](a) Dissolve 1g of PBI in 30g of N,N-dimethylformamide to obtain a PBI solution; divide the PBI solution into three equal parts and pour them into three horizontal flat molds of equal size, respectively, and heat at 60°C for 3h and heated at 100°C for 1 h to remove the solvent, and after natural cooling, the formed PBI film was peeled off from the flat mold to obtain 3 pieces of PBI film with a thickness of 25 μm;

[0031] (b) Under stirring conditions, heat the mixture of 40g bismaleimide diphenyl ether and 40g diallyl bisphenol S at 150°C to a transparent solution, and keep the temperature for about 40min to obtain bismaleimide Imide-based diphenyl ether / diallyl bisphenol S prepolymer solution is poured into two preheated flat molds of the same size (the length and width of the mold are the same as the length and width of the mold in (a) same), vacuumize at 150°C for about 30 minutes, then cool naturally to room temperature, and take out 2 prepolymer plates;

[0032] ...

Embodiment 3

[0039] (a) Dissolve 0.84g of PBI in 20g of N,N-dimethylacetamide to obtain a PBI solution; averagely divide the PBI solution into 4 equal parts and pour them into 4 horizontal flat molds of the same size, respectively, at 60°C Heating for 3 hours and 100°C for 1 hour to remove the solvent, and after natural cooling, peel the formed PBI film from the flat mold to obtain 4 pieces of PBI film with a film thickness of about 10 µm;

[0040] (b) Under stirring conditions, heat 40g of bismaleimide diphenylmethane and 26g of allylphenol epoxy (bisphenol A diallyl diglycidyl ether) resin mixture to a transparent solution at 140°C , and then keep the temperature for about 40 minutes to obtain the bismaleimidodiphenylmethane / allylphenol epoxy resin prepolymer solution, which is divided into 3 equal parts and poured into 3 preheated flat molds respectively (The length and width of the mold are the same as the length and width of the mold in (a)), vacuumize at 140°C for about 30 minutes, t...

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Abstract

The invention relates to a high-toughness bismaleimide resin system and a preparation method thereof. Using bismaleimide, allyl compounds and thermoplastic polybenzimidazole (PBI) as raw materials, by preparing a PBI film, the It is cross-laminated with a bismaleimide / allyl compound resin system prepolymer sheet, and a bismaleimide / allyl compound resin system material containing a PBI film is obtained through thermal curing treatment. The material prepared by the invention can obtain outstanding impact resistance when a small amount of PBI film is inserted, and its thermal properties and other mechanical properties are higher or not lower than the bismaleimide / allyl compound resin without PBI film inserted The material system has obvious application value in the fields of high-performance composite materials such as aviation and aerospace.

Description

technical field [0001] The invention relates to the field of high-performance resin-based composite materials, in particular to a high-toughness bismaleimide resin material and a preparation method thereof. technical background [0002] Bismaleimide (BMI) resin is a bifunctional compound with maleimide as the active terminal group. Its cured product has excellent mechanical properties, thermal properties and low dielectric properties, making BMI widely used. in aerospace and other fields. However, BMI resin has high crosslinking density after curing, which makes BMI material have the disadvantages of high brittleness and poor impact resistance, which makes the BMI resin matrix prone to cracks, which seriously affects the application of BMI resin in high-performance composite materials. [0003] The use of allyl compounds to modify BMI is one of the most successful methods in the toughening and modification of BMI resins. The obtained allyl compound modified BMI system has s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/06B32B27/28B32B27/18B32B27/08
CPCB32B27/08B32B27/18B32B27/28B32B37/06B32B2307/558
Inventor 袁莉张权顾嫒娟梁国正
Owner SUZHOU UNIV
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