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Water-soluble adhesive used for powder micro-injection shaping and preparation method thereof

A water-soluble binder and micro-injection technology, which is applied in the field of powder injection and micro-injection molding, can solve the problems of difficult and effective control of dissolution and stripping, and achieve the effects of low cost, fast degreasing rate, and favorable forming and demoulding.

Inactive Publication Date: 2017-04-26
上海精科智能科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] When using powder microinjection molding technology to prepare micro parts, it usually needs to go through solvent degreasing process, and ethylene-vinyl acetate in the binder component is generally prone to swelling defects in organic degreasing solvents such as n-hexane, n-heptane, and chloroform , this is because ethylene-vinyl acetate is insoluble in water, so it is not easy to effectively control the generation of defects in organic solvents. It is urgent to improve the existing technology for this defect.

Method used

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Examples

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Effect test

Embodiment 1

[0019] In the water-soluble binder for powder microinjection molding, the mass fractions of each component are: 20% polyethylene glycol with a molecular weight of 1000, 20% polyethylene glycol with a molecular weight of 2000, polyvinyl butyral 20%, ethylene-vinyl acetate 30%, stearic acid 10%.

[0020] The preparation method of the powder microinjection molding water-soluble binder comprises the following steps:

[0021] 1) Weigh each component according to the formula;

[0022] 2) In the constant temperature device, under the temperature condition of 150 ℃, all the low melting point polyethylene glycol with a molecular weight of 1000 and polyethylene glycol with a molecular weight of 2000 are melted;

[0023] 3) Add ethylene-vinyl acetate and stearic acid to the polyethylene glycol solution in step 2), and stir to mix evenly;

[0024] 4) Finally, put polyvinyl butyral into the mixture in batches, stir until a uniform emulsion is obtained, take it out after cooling, and obta...

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PUM

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Abstract

The invention discloses a water-soluble adhesive used for powder micro-injection shaping and a preparation method thereof. The method includes the steps of: in a temperature constant apparatus, completely melting low-melt-point polyethylene glycol and adding weighed ethylene-vinyl acetate and stearic acid with continuous stirring, and adding polyvinyl butyral in batches with intensive stirring until a homogeneous emulsion is formed; and cooling the homogeneous emulsion to prepare a finish product of the adhesive. The adhesive includes, by mass, 20-40% of the polyethylene glycol being 1000-2000 in molecular weight, 20-40% of the ethylene-vinyl acetate, 20-40% of the polyvinyl butyral, and 5-10% of the stearic acid. The components are all environment-friendly. The exsolution solvent is distilled water so that degreasing rate is high. With the polyvinyl butyral and the ethylene-vinyl acetate as skeleton polymer in the water-soluble adhesive system, not only is material feeding effect improved but also the shape of a blank body during degreasing process is maintained, thereby avoiding collapse and deformation of the blank body.

Description

technical field [0001] The invention relates to the technical field of powder microinjection molding, in particular to a water-soluble binder for powder microinjection molding and a preparation method thereof. Background technique [0002] The potential market for microsystem technology and related products is huge, and it has been applied in information and communication technology, medical and biotechnology, micro-transmission optical parts preparation technology and other fields. In order to develop the development potential of microsystem technology, mass production is cost-effective and the structural details are reduced The complex micro-parts down to the micron level are very important, so the research on micro-system technology continues to deepen, and the application is also becoming more and more extensive. [0003] The preparation methods of micro-parts mostly adopt traditional micro-machining technology, such as micro-cutting, laser cutting, silicon etching techn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/08C08L71/02C08L29/14C08K5/09C04B35/634C04B35/632
CPCC08L23/0853C04B35/632C04B35/63416C04B35/6342C04B35/63488C08L2205/025C08L2205/035
Inventor 宋金帅
Owner 上海精科智能科技股份有限公司
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