A kind of cooling liquid for diamond wire cutting single/polycrystalline silicon rod

Abstract

The invention relates to cooling liquid used when monocrystalline silicon / polycrystalline silicon rods are cut by diamond wires. The cooling liquid used when the monocrystalline silicon / polycrystalline silicon rods are cut by the diamond wires is prepared from, by weight, 5-10 parts of extreme pressure lubricant, 1-5 parts of penetrant, 10-20 parts of dispersing agent, 1-5 parts of solubilizer, 0.5-5 parts of defoamer and the balance water, wherein the total weight part is 100. The cooling liquid has the following advantages that the added extreme pressure lubricant has excellent extreme pressure lubricating performance, the matter can be adsorbed on the surfaces of the diamond wires to form lubricating films, abrasion between the diamond wires and the silicone rods is reduced, and adsorption of silicone powder generated by cutting on the surfaces of the wires can be avoided.

Description

technical field [0001] The invention relates to a cooling liquid, in particular to a cooling liquid for diamond wire cutting single / polycrystalline silicon rods. Background technique [0002] At present, as the price of solar mono / polycrystalline silicon wafers continues to fall, it is difficult to make new breakthroughs in the production cost and production efficiency of the general-purpose mortar steel wire cutting process. The inevitable trend of replacing mortar steel wire cutting. However, the diamond wire cutting coolant currently used in the market still has certain defects, such as deep cutting lines on silicon wafers, dirty silicon wafer surfaces, large diamond wire wear, foam overflowing the cylinder during cutting, and other problems. Aiming at these defective problems, the present invention can well solve such problems. Contents of the invention [0003] The technical problem to be solved by the embodiments of the present invention is that, in view of the hig...

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Problems solved by technology

[0003] The technical problem to be solved by the embodiments of the present invention is that, in view of the high wear between the existing diamond wire and the silicon rod, the silicon powder produced by cutting is prone to adsorption on the surface of the silicon wafer and the surface of the diamond wire, resulting in the silicon powder cut out The surface of the chip is dirty, and the chip removal ability of the diamond wire becomes poor, etc.