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A kind of cyanide-free ionic liquid copper plating solution and copper plating process

A cyanide ion and copper plating technology, which is applied in the field of cyanide-free ionic liquid copper plating solution and copper plating process, can solve the problems of coarse crystal structure of the plating layer, impossibility of copper plating, high requirements for electroplating parameter control, and achieve wide temperature range and high current density. wide range of effects

Active Publication Date: 2019-05-03
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The composition of sulfate copper plating solution is simple and the plating solution is stable, but the crystalline structure of the plating layer is relatively coarse, and copper plating on iron and iron alloys cannot be directly performed; pyrophosphate copper plating solution can obtain satisfactory performance, but the control requirements of electroplating parameters are high, combining power still needs to be improved

Method used

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  • A kind of cyanide-free ionic liquid copper plating solution and copper plating process
  • A kind of cyanide-free ionic liquid copper plating solution and copper plating process
  • A kind of cyanide-free ionic liquid copper plating solution and copper plating process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Example 1, a plating solution in which the molar ratio of cuprous chloride to 1-ethyl 3-methylimidazole chloride is 1:1, 60°C, 0.5A / dm 2

[0033]After conventional degreasing, pickling and water washing, the iron sheet is rinsed with alcohol and dried. Immerse the iron piece in a plating solution with a molar ratio of 1:1 of cuprous chloride and 1-ethyl 3-methylimidazole chloride heated to 60°C. The copper wire is used as the anode, and the iron sheet is used as the cathode, which is connected to the positive and negative poles of the DC power supply. at 0.5A / dm 2 The current density was applied for 20 minutes. A copper-colored appearance was obtained with a thickness of 4 μm. The X-ray diffraction spectrum of the coating is as figure 1 As shown, it can be seen that the coating is crystalline copper, and the iron peak in the figure comes from the matrix; the surface morphology is as follows figure 2 As shown, it can be seen that the coating is composed of round p...

Embodiment 2

[0034] Example 2, a plating solution with a molar ratio of cuprous chloride to 1-ethyl 3-methylimidazole chloride of 1:1, 25°C, 0.5A / dm 2

[0035] After conventional degreasing, pickling and water washing, the platinum sheet was rinsed with alcohol and dried. The platinum sheet was immersed in a plating solution with a molar ratio of 1:1 of cuprous chloride and 1-ethyl 3-methylimidazole chloride heated to 25°C. The copper wire is used as the anode, and the platinum sheet is used as the cathode, which is connected to the positive and negative poles of the DC power supply. at 0.5A / dm 2 The current density is applied for 5 minutes to obtain a copper-colored appearance with a thickness of 1 μm.

[0036] The X-ray diffraction spectrum of the coating shows that the coating is crystalline copper, and the surface morphology is as follows: image 3 As shown, it can be seen that the coating is composed of strip particles with a length of about 0.4 μm, which are uniform and dense.

Embodiment 3

[0037] Example 3, a plating solution in which the molar ratio of cuprous chloride to 1-ethyl 3-methylimidazole chloride is 1:1, 80°C, 5A / dm 2

[0038] After conventional degreasing, pickling and water washing, the iron wire is rinsed with alcohol and dried. Immerse in a plating solution with a molar ratio of 1:1 of cuprous chloride and 1-ethyl 3-methylimidazole chloride heated to 80°C. The copper wire is used as the anode, and the iron wire is used as the cathode, which is connected to the positive and negative poles of the DC power supply. at 5A / dm 2 The current density was applied for 5 minutes. A copper-colored appearance was obtained with a thickness of 10 μm. The X-ray diffraction spectrum of the coating shows that the coating is crystalline copper, and the appearance of the coating is as follows: Figure 4 As shown, it is composed of flakes, which are uniform and dense.

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Abstract

The invention discloses a cyanide-free ionic-liquid copper-plating solution and a copper plating process. The cyanide-free ionic-liquid copper-plating solution is composed of cuprous chloride and chlorinated 1-ethyl-3-methylimidazole in a mol ratio of 1: (2-1); and the above two powders are weighed by mol mass and mixed at normal temperature so as to obtain the copper-plating solution. In a plating tank, the temperature of the copper-plating solution is 25 to 80 DEG C, and copper plating is carried out under the conditions that current density is 0.5 to 5 A / dm<2>, a copper wire is used as a positive electrode, a conductive to-be-plated member is used as a negative electrode, and the positive electrode and the negative electrode are connected with the positive and negative electrodes of a direct-current source; and plating time depends on current density during plating and desired plating thickness. When the environment-friendly cyanide-free copper-plating solution provided by the invention is used for copper plating, the ranges of copper-plating temperature and current density are large.

Description

technical field [0001] The invention relates to a copper plating solution and a copper plating process in surface treatment technology, in particular to a cyanide-free ion liquid copper plating solution and a copper plating process. Background technique [0002] Copper is ductile, thermally and electrically conductive, soft and easy to polish. Copper electroplating technology is widely used in printed circuit boards, plastic electroplating, and pre-plating before Ni and Cr plating on steel surfaces to improve the bonding force between the surface coating and the substrate. It is one of the main plating types in the electroplating industry. At present, there are many types of copper plating solutions used in the field of electroplating, including cyanide copper plating solutions, sulfate copper plating solutions, pyrophosphate copper plating solutions, and citrate copper plating solutions. Among them, the cyanide copper plating layer has fine crystallization, strong covering...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 凌国平庄晨
Owner ZHEJIANG UNIV